jetway 601cfr4a 사용자 설명서

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Manual Revision Information 
 
Reversion  
Revision History 
  Date 
4.0   
 
Fourth Edition     
  November 2001 
 
Item Checklist 
601CF Motherboard   
Cable for IDE/Floppy 
CD for motherboard utilities 
601CF User’s Manual 
 
 
Intel
 Processor Family 
Thermal Solutions 
As processor technology pushes to faster speeds and higher performance, thermal 
management becomes increasingly crucial when building computer systems. 
Maintaining the proper thermal environment is key to reliable, long-term system 
operation. The overall goal in providing the proper thermal environment is keeping the 
processor below its specified maximum case temperature. Heatsinks induce improved 
processor heat dissipation through increased surface area and concentrated airflow 
from attached fans. In addition, interface materials allow effective transfers of heat 
from the processor to the heatsink. For optimum heat transfer, Intel recommends the 
use of thermal grease and mounting clips to attach the heatsink to the processor.  
When selecting a thermal solution for your system, please refer to the website below 
for collection of heatsinks evaluated and recommended by Intel for use with Intel 
processors.  
 
Vendor list for heatsink and fan of Pentium® !!! processor, please visit: 
http://developer.intel.com/design/Pentiumiii/components/index.htm 
Vendor list for heatsink and fan of Intel®Celeron™ processor, please visit: 
http://developer.intel.com/design/celeron/components/index.htm 
 
 
 
 
Chapter 1