jetway 603tcr4a 사용자 설명서

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Manual Revision Information 
 
Reversion  
Revision History 
  Date 
4.0   
 
Fourth Edition     
  August 2002 
 
Item Checklist 
5
 
603TCF/603TCFL Motherboard   
5
 
Cable for IDE/Floppy 
5
 
CD for motherboard utilities 
5
 
603TCF/603TCFL User’s Manual 
 
 
Intel
 Processor Family 
Thermal Solutions 
As processor technology pushes to faster speeds and higher performance, thermal 
management becomes increasingly crucial when building computer systems. Maintaining 
the proper thermal environment is key to reliable, long-term system operation. The 
overall goal in providing the proper thermal environment is keeping the processor 
below its specified maximum case temperature. Heatsinks induce improved processor 
heat dissipation through increased surface area and concentrated airflow from attached 
fans. In addition, interface materials allow effective transfers of heat from the 
processor to the heatsink. For optimum heat transfer, Intel recommends the use of 
thermal grease and mounting clips to attach the heatsink to the processor.  
When selecting a thermal solution for your system, please refer to the website below 
for collection of heatsinks evaluated and recommended by Intel for use with Intel 
processors.  
 
Vendor list for heatsink and fan of Pentium® !!! processor, please visit: 
http://developer.intel.com/design/Pentiumiii/components/index.htm 
Vendor list for heatsink and fan of Intel®Celeron™ processor, please visit: 
http://developer.intel.com/design/celeron/components/index.htm