Intel X5675 BX80614X5675 사용자 설명서

제품 코드

BX80614X5675

Intel

Xeon

Processor 5600 Series Datasheet Volume 1

Contents

Introduction ............................................................................................................ 11
1.1

Processor Features ............................................................................................ 12

1.2

Platform Features.............................................................................................. 12

1.3

Terminology ..................................................................................................... 13

1.4

References ....................................................................................................... 15

Electrical Specifications ........................................................................................... 17
2.1

Processor Signaling ........................................................................................... 17
2.1.1

Intel® QuickPath Interconnect ............................................................... 17

2.1.2

DDR3 Signal Groups.............................................................................. 17

2.1.3

Platform Environmental Control Interface (PECI) ....................................... 17

2.1.4

Processor Sideband Signals .................................................................... 18

2.1.5

System Reference Clock ........................................................................ 18

2.1.6

Test Access Port (TAP) Signals................................................................ 19

2.1.7

Power / Other Signals............................................................................ 20

2.1.8

Reserved or Unused Signals ................................................................... 27

2.2

Signal Group Summary ...................................................................................... 28

2.3

Mixing Processors.............................................................................................. 29

2.4

Flexible Motherboard Guidelines (FMB) ................................................................. 30

2.5

Absolute Maximum and Minimum Ratings ............................................................. 31

2.6

Processor DC Specifications ................................................................................ 32
2.6.1

VCC Overshoot Specifications ................................................................. 35

2.6.2

Die Voltage Validation ........................................................................... 36

2.7

Intel® QuickPath Interconnect Specifications ........................................................ 47

2.8

AC Specifications............................................................................................... 49

2.9

Processor AC Timing Waveforms ......................................................................... 56

Signal Quality Specifications.................................................................................... 67
3.1

Overshoot/Undershoot Tolerance......................................................................... 67

Package Mechanical Specifications .......................................................................... 69
4.1

Package Mechanical Specifications ....................................................................... 69
4.1.1

Package Mechanical Drawing .................................................................. 70

4.1.2

Processor Component Keep-Out Zones .................................................... 73

4.1.3

Package Loading Specifications............................................................... 73

4.1.4

Package Handling Guidelines .................................................................. 73

4.1.5

Package Insertion Specifications ............................................................. 73

4.1.6

Processor Mass Specification .................................................................. 74

4.1.7

Processor Materials ............................................................................... 74

4.1.8

Processor Markings ............................................................................... 74

Land Listing............................................................................................................. 75
5.1

Listing by Land Name ........................................................................................ 75

5.2

Listing by Land Number ..................................................................................... 92

Signal Definitions .................................................................................................. 111
6.1

Signal Definitions ............................................................................................ 111

Thermal Specifications .......................................................................................... 115
7.1

Package Thermal Specifications......................................................................... 115
7.1.1

Thermal Specifications......................................................................... 115

7.1.2

Thermal Metrology .............................................................................. 130

7.2

Processor Thermal Features .............................................................................. 130
7.2.1

Processor Temperature........................................................................ 130

7.2.2

Adaptive Thermal Monitor .................................................................... 131