MICROCHIP TECHNOLOGY INC. BM23SPKXYC2A 사용자 설명서
Stereo Module
2015 Microchip Technology Inc.
Page 34
Preliminary Edition
8.0 PACKAGING AND STORAGE INFORMATION
The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format.
These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a
dimension of 36 * 16 * 9.5 cm
dimension of 36 * 16 * 9.5 cm
3
.
The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity.
After a bag is opened, devices that will be subjected to reflow solder or other high temperature
processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative
humidity.
After a bag is opened, devices that will be subjected to reflow solder or other high temperature
processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative
humidity.