Intel i3-3110M AW8063801032700 사용자 설명서

제품 코드

AW8063801032700

Datasheet, Volume 1

Figures

1-1

Mobile Processor Platform........................................................................................ 12

1-2

Mobile Processor Compatibility Diagram .................................................................... 19

2-1

Intel

Flex Memory Technology Operation................................................................. 28

2-2

PCI Express* Layering Diagram................................................................................ 30

2-3

Packet Flow Through the Layers ............................................................................... 31

2-4

PCI Express* Related Register Structures in the Processor ........................................... 32

2-5

PCI Express* Typical Operation 16 Lanes Mapping ...................................................... 33

2-6

Processor Graphics Controller Unit Block Diagram ....................................................... 35

2-7

Processor Display Block Diagram .............................................................................. 38

4-1

Processor Power States ........................................................................................... 51

4-2

Idle Power Management Breakdown of the Processor Cores ......................................... 55

4-3

Thread and Core C-State Entry and Exit .................................................................... 55

4-4

Package C-State Entry and Exit................................................................................ 59

5-1

Package Power Control............................................................................................ 71

5-2

Frequency and Voltage Ordering .............................................................................. 79

7-1

Example for PECI Host-Clients Connection ............................................................... 110

7-2

Input Device Hysteresis ........................................................................................ 111

8-1

rPGA988B (Socket-G2) Pin Map.............................................................................. 113

8-2

BGA1224 Ballmap (left side) .................................................................................. 125

8-3

BGA1224 Ballmap (right side) ................................................................................ 126

8-4

BGA1023 Ballmap (left side) .................................................................................. 144

8-5

BGA1023 Ballmap (right side) ................................................................................ 145

8-6

Processor rPGA988B 2C/GT1 (G24406) Mechanical Package (Sheet 1 of 2) .................. 160

8-7

Processor rPGA988B 2C/GT1 (G24406) Mechanical Package (Sheet 2 of 2) .................. 161

8-8

Processor rPGA988B 2C/GT2 (G23867) Mechanical Package (Sheet 1 of 2) .................. 162

8-9

Processor rPGA988B 2C/GT2 (G23867) Mechanical Package (Sheet 2 of 2) .................. 163

8-10 Processor rPGA988B 4C/GT2 (E95127) Mechanical Package (Sheet 1 of 2)................... 164
8-11 Processor rPGA988B 4C/GT2 (E95127) Mechanical Package (Sheet 2 of 2)................... 165
8-12 Processor BGA1023 2C/GT1 (G24405) Mechanical Package ........................................ 166
8-13 Processor BGA1023 2C/GT2 (G23866) Mechanical Package ........................................ 167
8-14 Processor BGA1224 4C/GT2 (G26204) Mechanical Package ........................................ 168

Tables

1-1

Mobile 3rd Generation Intel

Core™ Processor Family SKUs......................................... 18

1-2

Terminology .......................................................................................................... 20

1-3

Related Documents ................................................................................................ 23

2-1

Processor Mobile DIMM Support Summary by Product ................................................. 25

2-2

Supported DDR3 / DDR3L / DDR3L-RS SO-DIMM Module Configurations ....................... 26

2-3

Supported Maximum Memory Size Per DIMM ............................................................. 26

2-4

DDR3 / DDR3L / DDR3L-RS at 1.5 V System Memory Timing Support ........................... 27

2-5

DDR3L / DDR3L-RS System Memory Timing Support................................................... 27

2-6

Reference Clock ..................................................................................................... 40

4-1

System States ....................................................................................................... 52

4-2

Processor Core / Package State Support.................................................................... 52

4-3

Integrated Memory Controller States ........................................................................ 52

4-4

PCI Express* Link States......................................................................................... 53

4-5

Direct Media Interface (DMI) States.......................................................................... 53

4-6

Processor Graphics Controller States......................................................................... 53

4-7

G, S, and C State Combinations ............................................................................... 53

4-8

D, S, and C State Combination................................................................................. 54

4-9

Coordination of Thread Power States at the Core Level................................................ 56

4-10 P_LVLx to MWAIT Conversion .................................................................................. 56