Intel E3-1275 v3 BX80646E31275V3 사용자 설명서
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제품 코드
BX80646E31275V3
7.4 Reserved or Unused Signals................................................................................... 91
7.5 Signal Groups.......................................................................................................91
7.6 Test Access Port (TAP) Connection.......................................................................... 93
7.7 DC Specifications................................................................................................. 93
7.8 Voltage and Current Specifications.......................................................................... 94
7.5 Signal Groups.......................................................................................................91
7.6 Test Access Port (TAP) Connection.......................................................................... 93
7.7 DC Specifications................................................................................................. 93
7.8 Voltage and Current Specifications.......................................................................... 94
7.8.1 PECI DC Characteristics............................................................................. 99
7.8.2 Input Device Hysteresis........................................................................... 100
7.8.2 Input Device Hysteresis........................................................................... 100
8.1 Processor Component Keep-Out Zone.................................................................... 101
8.2 Package Loading Specifications............................................................................. 101
8.3 Package Handling Guidelines................................................................................ 102
8.4 Package Insertion Specifications............................................................................102
8.5 Processor Mass Specification.................................................................................102
8.6 Processor Materials............................................................................................. 102
8.7 Processor Markings............................................................................................. 103
8.8 Processor Land Coordinates..................................................................................103
8.9 Processor Storage Specifications........................................................................... 104
8.2 Package Loading Specifications............................................................................. 101
8.3 Package Handling Guidelines................................................................................ 102
8.4 Package Insertion Specifications............................................................................102
8.5 Processor Mass Specification.................................................................................102
8.6 Processor Materials............................................................................................. 102
8.7 Processor Markings............................................................................................. 103
8.8 Processor Land Coordinates..................................................................................103
8.9 Processor Storage Specifications........................................................................... 104
Figures
Contents—Processor
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
June 2013
Datasheet – Volume 1 of 2
Order No.: 328907-001
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