Fujifilm Xeon 5060 S26361-F3312-L320 데이터 시트
제품 코드
S26361-F3312-L320
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
97
Boxed Processor Specifications
8
Boxed Processor Specifications
8.1
Introduction
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Dual-Core Intel
components available through distribution channels. The Dual-Core Intel
®
Xeon
®
Processor 5100 Series will be offered as an Intel boxed processor.
Intel will offer the Dual-Core Intel
®
Xeon
®
Processor 5100 Series with two heat sink
configurations available for each processor frequency: 1U passive/3U+ active
combination solution and a 2U passive only solution. The 1U passive/3U+ active
combination solution is based on a 1U passive heat sink with a removable fan that will
be pre-attached at shipping. This heat sink solution is intended to be used as either a
1U passive heat sink, or a 3U+ active heat sink. Although the active combination
solution with removable fan mechanically fits into a 2U keepout, its use is not
recommended in that configuration.
combination solution and a 2U passive only solution. The 1U passive/3U+ active
combination solution is based on a 1U passive heat sink with a removable fan that will
be pre-attached at shipping. This heat sink solution is intended to be used as either a
1U passive heat sink, or a 3U+ active heat sink. Although the active combination
solution with removable fan mechanically fits into a 2U keepout, its use is not
recommended in that configuration.
The 1U passive/3U+ active combination solution in the active fan configuration is
primarily designed to be used in a pedestal chassis where sufficient air inlet space is
present and strong side directional airflow is not an issue. The 1U passive/3U+ active
combination solution with the fan removed and the 2U passive thermal solution require
the use of chassis ducting and are targeted for use in rack mount or pedestal servers.
The retention solution used for these products is called the Common Enabling Kit, or
CEK. The CEK base is compatible with both thermal solutions and uses the same hole
locations as the Intel
primarily designed to be used in a pedestal chassis where sufficient air inlet space is
present and strong side directional airflow is not an issue. The 1U passive/3U+ active
combination solution with the fan removed and the 2U passive thermal solution require
the use of chassis ducting and are targeted for use in rack mount or pedestal servers.
The retention solution used for these products is called the Common Enabling Kit, or
CEK. The CEK base is compatible with both thermal solutions and uses the same hole
locations as the Intel
®
Xeon
®
processor with 800 MHz system bus.
The 1U passive/3U+ active combination solution will utilize a removable fan capable of
4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active
thermal solution helps customers meet acoustic targets in pedestal platforms through
the motherboards’s ability to directly control the RPM of the processor heat sink fan.
See
4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active
thermal solution helps customers meet acoustic targets in pedestal platforms through
the motherboards’s ability to directly control the RPM of the processor heat sink fan.
See
for more details on fan speed control, and see
for more on
the PWM and PECI interface along with Digital Thermal Sensors (DTS).
through
are representations of the two heat sink solutions.
Figure 8-1. Boxed Dual-Core Intel
®
Xeon
®
Processor 5100 Series
1U Passive/3U+ Active Combination Heat Sink (With Removable Fan)