Fujifilm Xeon 5060 S26361-F3318-L320 데이터 시트
제품 코드
S26361-F3318-L320
Mechanical Specifications
42
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
9.
Refer to the Dual-Core Intel
®
Xeon
®
Processor 5100 SeriesThermal/Mechanical Design Guidelines or Dual-
Core Intel
®
Xeon
®
Processor LV 5138 in Embedded Applications Thermal/Mechanical Design Guidelines for
information on heatsink clip load metrology.
3.4
Package Handling Guidelines
includes a list of guidelines on a package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
Notes:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4.
These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5.
Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5
Package Insertion Specifications
The Dual-Core Intel
®
Xeon
®
Processor 5100 Series can be inserted and removed 15
times from an LGA771 socket.
3.6
Processor Mass Specifications
The typical mass of the Dual-Core Intel
®
Xeon
®
Processor 5100 Series is 21.5 grams
[0.76 oz.]. This includes all components which make up the entire processor product.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Units
Notes
Shear
311
70
N
lbf
1,4,5
Tensile
111
25
N
lbf
2,4,5
Torque
3.95
35
N-m
LBF-in
3,4,5