Fujifilm Xeon DP S26361-F3310-L280 데이터 시트
제품 코드
S26361-F3310-L280
Datasheet
35
3.0
Mechanical Specifications
The Low Voltage Intel
®
Xeon™ processor with 800 MHz system bus is packaged in Flip Chip
Micro Pin Grid Array (FC-mPGA4) package that interfaces to the baseboard via an mPGA604
socket. The package consists of a processor core mounted on a substrate pin-carrier. An integrated
heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface
for processor component thermal solutions, such as a heat sink.
socket. The package consists of a processor core mounted on a substrate pin-carrier. An integrated
heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface
for processor component thermal solutions, such as a heat sink.
shows a sketch of the
processor package components and how they are assembled together. Refer to the mPGA604
Socket Design Guidelines for complete details on the mPGA604 socket.
Socket Design Guidelines for complete details on the mPGA604 socket.
The package components shown in
include the following:
1. Integrated Heat Spreader (IHS)
2. Processor die
3. Substrate
4. Pin side capacitors
5. Package pin
6. Die Side Capacitors
NOTE: This drawing is not to scale and is for reference only. The mPGA604 socket is not shown.
3.1
Package Mechanical Drawings
The package mechanical drawings are shown in
and
. The drawings include
dimensions necessary to design a thermal solution for the processor. These dimensions include:
1. Package reference and tolerance dimensions (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
6. All drawing dimensions are in mm [in.].
Figure 5.
Processor Package Assembly Sketch
2
2
1
2
6
4
5
3