Linear Technology LT6200CS6-5#TRMPBF Linear IC LT6200CS6-5#TRMPBF 데이터 시트

23

62001ff

LT6200/LT6200-5

LT6200-10/LT6201

(Reference LTC DWG # 05-08-1636)

× 3mm)

(Reference LTC DWG # 05-08-1698 Rev C)

3.00 

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE 

    MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION 

  ON TOP AND BOTTOM OF PACKAGE  

0.40 

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65 

± 0.10

(2 SIDES)

0.75 

±0.05

R = 0.125

TYP

2.38 

±0.10

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD8) DFN 0509 REV C

0.25 

± 0.05

2.38 

±0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

1.65 

±0.05

(2 SIDES)

2.10 

±0.05

0.50

BSC

0.70 

±0.05

3.5 

±0.05

PACKAGE

OUTLINE

0.25 

± 0.05

0.50 BSC

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.30 – 0.45 

6 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S6 TSOT-23 0302 REV B

2.90 BSC

(NOTE 4)

0.95 BSC

1.90 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

PIN ONE ID

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193