Intel 2 Duo E8200 BX80570E8200 데이터 시트

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BX80570E8200
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Datasheet
9
Introduction
1
Introduction
The Intel
®
 Core™2 Duo processor E8000 series , like the previous Intel
®
 Core
2 Duo 
processors, are based on the Intel
®
 Core
TM
 microarchitecture. The Intel Core 
microarchitecture combines the performance of previous generation Desktop products 
with the power efficiencies of a low-power microarchitecture to enable smaller, quieter 
systems. The Intel
®
 Core™2 Duo processor E8000 series are 64-bit processors that 
maintain compatibility with IA-32 software. 
Note:
In this document, the Intel
®
 Core™2 Duo processor E8000 series may be referred to 
simply as "the processor."
Note:
In this document, unless otherwise specified, the Intel
®
 Core™2 Duo processor E8000 
series refers to the Intel
®
 Core™2 Duo processors E8500, E8400, E8200, and E8190. 
The processors use Flip-Chip Land Grid Array (FC-LGA6) package technology, and plugs 
into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the 
LGA775 socket. 
The processors are based on 45 nm process technology. The processors feature the 
Intel
®
 Advanced Smart Cache, a shared multi-core optimized cache that significantly 
reduces latency to frequently used data. The processors feature a 1333 MHz front side 
bus (FSB) and 6 MB of L2 cache. The processors support all the existing Streaming 
SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental 
Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 
(SSE4.1). The processors support several Advanced Technologies: Execute Disable Bit, 
Intel
®
 64 architecture, Enhanced Intel SpeedStep
®
 Technology, Intel
®
 Virtualization 
Technology (Intel
®
 VT), and Intel
®
 Trusted Execution Technology (Intel
®
 TXT). 
The processor's front side bus (FSB) use a split-transaction, deferred reply protocol. 
The FSB uses Source-Synchronous Transfer of address and data to improve 
performance by transferring data four times per bus clock (4X data transfer rate). 
Along with the 4X data bus, the address bus can deliver addresses two times per bus 
clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 
4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s. 
Intel has enabled support components for the processor including heatsink, heatsink 
retention mechanism, and socket. Manufacturability is a high priority; hence, 
mechanical assembly may be completed from the top of the baseboard and should not 
require any special tooling.
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in 
the active state when driven to a low level. For example, when RESET# is low, a reset 
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has 
occurred. In the case of signals where the name does not imply an active state but 
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies 
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and 
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“Front Side Bus” refers to the interface between the processor and system core logic 
(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, 
memory, and I/O.