Texas Instruments IC FLPT TMS320C28346ZFET PBGA-256 TID TMS320C28346ZFET 데이터 시트
제품 코드
TMS320C28346ZFET
PREFIX
TMS 320
C
28346
ZFE
TMX = experimental device
TMP = prototype device
TMS = qualified device
TMP = prototype device
TMS = qualified device
DEVICE FAMILY
320 = TMS320 Device Family
TECHNOLOGY
TEMPERATURE RANGE
ZFE = 256-ball Plastic BGA (lead-free)
ZHH = 179-ball Microstar BGA (lead-free)
ZHH = 179-ball Microstar BGA (lead-free)
C = Non-Flash (1.1/1.2-V Core/3.3-V I/O)
DEVICE
28346
28345
28344
28343
28342
28341
28345
28344
28343
28342
28341
BGA = Ball Grid Array
T = −40
°
= −40°C to 125°C
= −40°C to 125°C (Q100 qualification)
°C to 105 C
S
Q
Q
T
PACKAGE TYPE
SPRS516D – MARCH 2009 – REVISED AUGUST 2012
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZFE) and temperature range (for example, T).
package type (for example, ZFE) and temperature range (for example, T).
provides a legend
for reading the complete device name for any family member.
Figure 5-1. Example of C2834x Device Nomenclature
102
Device Support
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