Texas Instruments LM3445 Evaluation Board LM3445-230VFLBK/NOPB LM3445-230VFLBK/NOPB 데이터 시트
제품 코드
LM3445-230VFLBK/NOPB
SNVS570L – JANUARY 2009 – REVISED MAY 2013
ELECTRICAL CHARACTERISTICS (continued)
Limits in standard type face are for T
J
= 25°C and those with boldface type apply over the full Operating Temperature
Range ( T
J
=
−
40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at T
J
= +25ºC, and are provided for reference purposes only.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
INTERNAL PWM RAMP
f
RAMP
Frequency
5.85
kHz
V
RAMP
Valley voltage
0.96
1.00
1.04
V
Peak voltage
2.85
3.00
3.08
D
RAMP
Maximum duty cycle
96.5
98.0
%
DIM DECODER
t
ANG_DET
Angle detect rising threshold
Observed on BLDR pin
6.79
7.21
7.81
V
V
ASNS
ASNS filter delay
4
µs
ASNS VMAX
3.85
4.00
4.15
V
I
ASNS
ASNS drive capability sink
V
ASNS
= 2V
7.6
mA
ASNS drive capability source
V
ASNS
= 2V
-4.3
DIM low sink current
V
DIM
= 1V
1.65
2.80
DIM High source current
V
DIM
= 4V
-4.00
-3.00
V
DIM
DIM low voltage
PWM input voltage
0.9
1.33
V
threshold
DIM high voltage
2.33
3.15
V
TSTH
Tri-state threshold voltage
Apply to FLTR1 pin
4.87
5.25
V
R
DIM
DIM comparator tri-state impedance
10
M
Ω
CURRENT SENSE COMPARATOR
V
FLTR2
FLTR2 open circuit voltage
720
750
780
mV
R
FLTR2
FLTR2 impedance
420
k
Ω
V
OS
Current sense comparator offset voltage
-4.0
0.1
4.0
mV
GATE DRIVE OUTPUT
V
DRVH
GATE high saturation
I
GATE
= 50 mA
0.24
0.50
V
V
DRVL
GATE low saturation
I
GATE
= 100 mA
0.22
0.50
I
DRV
Peak souce current
GATE = V
CC
/2
-0.77
A
Peak sink current
GATE = V
CC
/2
0.88
t
DV
Rise time
C
load
= 1 nF
15
ns
Fall time
C
load
= 1 nF
15
THERMAL SHUTDOWN
T
SD
Thermal shutdown temperature
See
(1)
165
°C
Thermal shutdown hysteresis
20
THERMAL SHUTDOWN
R
θ
JA
VSSOP-10 junction to ambient
121
°C/W
(1)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (T
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125°C), the maximum power dissipation
of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (R
θ
JA
), as
given by the following equation: T
A-MAX
= T
J-MAX-OP
– (R
θ
JA
× P
D-MAX
).
4
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