Texas Instruments TPS75525EVM Voltage Regulator Evaluation Module TPS75525EVM TPS75525EVM 데이터 시트
제품 코드
TPS75525EVM
2-2
EVM Test Setup
The following is a list of recommended equipment.
-
Power supply with 5-V and 8-A current limit connected to V
I
and GND.
-
Oscilloscope set to 100
µ
s/div and triggering off the falling edge of
channel 1.
J
Channel 1—set to 5 V/div, position at 2 V, and connected to TP1
J
Channel 2—set to 1 V/div, position at –1 V, measure high or max, and
connected to TP5 (U1)
connected to TP5 (U1)
J
Channel 3—set to 1 V/div, position at –4 V, measure high or max, and
connected to TP4 (U2)
connected to TP4 (U2)
-
Set the function generator to 1 Hz, 25% duty cycle, 0-V to 5-V amplitude
(may require a setting of 2.5-V square wave and 2.5-V dc offset) square
wave and connected across JP2 (per the schematic in Figure 1–1).
(may require a setting of 2.5-V square wave and 2.5-V dc offset) square
wave and connected across JP2 (per the schematic in Figure 1–1).
-
A variable resistance or electronic load capable of dissipating 10 W on J2
between V
between V
(CORE)
and GND and a similar variable resistance, or an
electronic load capable of dissipating 10 W on J2 between V
IO
and GND.
The following steps are recommended for evaluating the power-up
sequencing of the two devices:
sequencing of the two devices:
1) Turn on the power supply, then the function generator.
2) Set each variable resistance or electronic load so that each regulator will
provide the desired current. Do not exceed the maximum current of each
device.
device.
3) Verify on the oscilloscope that the voltage on channel 2 ramps up to 2.5 V
before the voltage on channel 3 ramps up to 3.3 V.
4) Turn off the function generator then the power supply. Disconnect the
function generator.
Other test setups are possible by changing the jumpers.
When performing tests that require the devices to provide large dc
currents, the test board, regulators, and loads will get hot. It is the
user’s responsibility to ensure that the test board and load
resistors can handle the power dissipation.
currents, the test board, regulators, and loads will get hot. It is the
user’s responsibility to ensure that the test board and load
resistors can handle the power dissipation.
Refer to the TPS755xx and TPS757xx datasheets for the maximum power dis-
sipation capabilities of the TO–263 and TO-220 packages. Additional air flow
may be required to achieve the desired power dissipation. If the junction tem-
perature of the device exceeds 125
sipation capabilities of the TO–263 and TO-220 packages. Additional air flow
may be required to achieve the desired power dissipation. If the junction tem-
perature of the device exceeds 125
°
C, the device may attempt to protect itself
from damage by entering a thermal shutdown mode. The device will have to
cool down before it can be restarted.
cool down before it can be restarted.