Texas Instruments TPS61160(1)-243 Evaluation Module TPS61160EVM-243 TPS61160EVM-243 사용자 설명서
제품 코드
TPS61160EVM-243
Introduction
1
Introduction
The Texas Instruments TPS6116xEVM-243 evaluation module contains a TPS61160 or TPS61161
integrated circuit (IC), supporting active and passive components and either 6 or 10 white light-emitting
diodes (WLEDs) in series. The goal of this EVM is to facilitate evaluation of the TPS61160 or TPS61161
in a typical WLED application.
integrated circuit (IC), supporting active and passive components and either 6 or 10 white light-emitting
diodes (WLEDs) in series. The goal of this EVM is to facilitate evaluation of the TPS61160 or TPS61161
in a typical WLED application.
1.1
Performance Specification Summary
provides a summary of the TPS6116xEVM-243 performance specifications. All specifications are
given for an ambient temperature of 25°C.
Table 1. Typical Performance Specification Summary
CONDITION
MIN
TYP
MAX
UNITS
V
IN
supply
9
18
V
CTRL=VIN, JP2 shorted
29.5
V
TPS61161
V
V
OUT
CTRL=VIN, JP2 open
37
38
39
V
CTRL=VIN, JP2 shorted
17.7
TPS61160
V
V
OUT
CTRL=VIN, JP2 open
25
26
27
I
OUT
JP2 shorted
19
20
21
mA
1.2
Modifications
To aid user customization of the EVM, the board was designed with devices having 0603 or larger
footprints. A real-world implementation should occupy less total board space.
footprints. A real-world implementation should occupy less total board space.
The inductor and compensation components (R1, C2) were designed for the V
IN
range shown in
.
Using a different input voltage range may require resizing of the inductor and/or the compensation
components. Also, changing components can improve or degrade EVM performance. For example, using
inductors with larger dc resistances lowers efficiency of the solution.
components. Also, changing components can improve or degrade EVM performance. For example, using
inductors with larger dc resistances lowers efficiency of the solution.
The other members of the TPS6116x IC family have the same footprint.
NOTE:
When modifying the REV A version of this PCB, it is strongly recommended that you heat
the PCB on a hot plate before using a soldering iron to remove/replace components,
especially the input capacitor and inductor. Otherwise, the expansion when soldering and
contraction when cooling of the wide traces/places connecting these components to the IC
pins can damage the IC. For further explanation and guidance, see the TI application report
QFN/SON PCB Attachment (
especially the input capacitor and inductor. Otherwise, the expansion when soldering and
contraction when cooling of the wide traces/places connecting these components to the IC
pins can damage the IC. For further explanation and guidance, see the TI application report
QFN/SON PCB Attachment (
2
Setup and Test Results
2.1
Input/Output Connections
The connection points are described in the following paragraphs.
2.1.1
J1-VIN
This header is the positive connection to the input power supply. Twist the leads to the input supply, and
keep them as short as possible.
keep them as short as possible.
2.1.2
J2-GND
This header is the return connection to the input power supply.
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2
TPS61160EVM-243/TPS61161EVM-243
SLVU221D – December 2007 – Revised May 2013
Copyright © 2007–2013, Texas Instruments Incorporated