Texas Instruments THS770012 Evaluation Module THS770012EVM THS770012EVM 데이터 시트
제품 코드
THS770012EVM
1
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
NC
NC
V
S+
NC
V
OUT-
V
OUT+
NC
NC
V
IN+
V
IN-
PD
140Ω
V
OCM
50Ω
50Ω
V
S+
V
S+
V
S+
GS+
GS-
Unused
Unused
200Ω
60Ω
2Ω
140Ω
200Ω
60Ω
2Ω
-
-
+
+
V
OCM
NC
GND
GND
GND
GND
SLOS669C
–
FEBRUARY 2010
–
REVISED JANUARY 2012
PIN CONFIGURATION
RGE PACKAGE
VQFN-24
(TOP VIEW)
PIN DESCRIPTIONS
PIN
DESCRIPTION
NO.
NAME
1
NC
No internal connection
2
PD
Power down. High = low power (sleep) mode. Low = active.
3
V
IN
–
Inverting input pin
4
V
IN+
Non-inverting input pin
5
V
OCM
Output common-mode voltage control input pin
6, 7
NC
No internal connection
8, 9, 10, 11
GND
Ground. Must be connected to thermal pad.
12
NC
No internal connection
13
GS-
Gain-setting connection for inverting output
14
Unused Bonded to die, but not used. Tie to GND.
15
V
OUT
–
Inverting output pin
16
V
OUT+
Non-inverting output pin
17
Unused Bonded to die, but not used. Tie to GND.
18
GS+
Gain-setting connection for non-inverting output
19
NC
No internal connection
20, 21, 22,
V
S+
Power supply pins, +5V nominal
23
24
NC
No internal connection
Thermal pad
Thermal pad on bottom of device is used for heat dissipation and must be tied to GND
6
Copyright
©
2010
–
2012, Texas Instruments Incorporated
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