Texas Instruments Evaluation Module for the LVCP600S SN75LVCP600SEVM SN75LVCP600SEVM 데이터 시트
제품 코드
SN75LVCP600SEVM
www.ti.com
SN75LVCP600S EVM Board Construction
3
SN75LVCP600S EVM Board Construction
The SN75LVCP600S EVM board is a 6-layer board constructed of FR4 – 370 material. The board stackup
consists of a signal layer on top, ground layer, power layer, two ground layers and a signal layer on
bottom.
consists of a signal layer on top, ground layer, power layer, two ground layers and a signal layer on
bottom.
The high-speed data signals of this board were routed as single-ended 50-
Ω
transmission lines, the
differential routing of these signals with 100-
Ω
impedance matching can be implemented as well.
Figure 11. SN75LVCP600S EVM Board Stack-Up
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SLLU144 – March 2011
SN75LVCP600S EVMPCB Construction
© 2011, Texas Instruments Incorporated