Texas Instruments Evaluation Module for TPS386000 TPS386000EVM-736 TPS386000EVM-736 데이터 시트
제품 코드
TPS386000EVM-736
EVM Assembly Drawings and Layout Guidelines
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Figure 6. Bottom-Side Layout/Routing
5.2
Layouts Guidelines
Thermal Pad
The thermal pad provides a thermal and mechanical interface between the device and the printed-circuit
board (PCB). Connect the exposed thermal pad of the PCB to the device VSS pins and provide at least a
3 x 3 pattern of PCB vias to connect the thermal pad and GND pin to the circuit ground on other PCB
layers.
board (PCB). Connect the exposed thermal pad of the PCB to the device VSS pins and provide at least a
3 x 3 pattern of PCB vias to connect the thermal pad and GND pin to the circuit ground on other PCB
layers.
Supply Voltage Decoupling
Provide power supply pin bypass to the device as follows:
•
0.1-µF, X5R ceramic at pin 15 (VCC)
•
1-nF, X7R ceramic at pins 6–10 (SENSE1, SENSE2, SENSE3, SENSE4L, and SENSE4H) although
not required can provide noise filtering in noisy power supply systems.
not required can provide noise filtering in noisy power supply systems.
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TPS3860xxEVM-736 Evaluation Modules
SLVU450 – March 2011
© 2011, Texas Instruments Incorporated