Texas Instruments TPS61258 Chip Scale step-up dc-dc converters, 3.5-MHz high efficiency Evaluation Module TPS61258EVM-76 TPS61258EVM-766 데이터 시트
제품 코드
TPS61258EVM-766
T
I
EXAS
NSTRUMENTS
TPS6125xEVM-766 Assembly Drawing and Layout
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TPS6125xEVM-766 Assembly Drawing and Layout
through
show the design of the TPS6125xEVM-766 PCBs. The EVM has been
designed using a four-layer, 1-ounce copper-clad PCB with all components in an active area on the top
side of the board. Moving components to both sides of the PCB can offer additional size reduction for
space-constrained systems.
side of the board. Moving components to both sides of the PCB can offer additional size reduction for
space-constrained systems.
Figure 6. TPS6125xEVM-766 Component Placement (Viewed TOP)
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TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip
SLVU744 – August 2012
Scale Packaging EVM
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