Texas Instruments DAC8560EVM - DAC8560EVM Evaluation Module DAC8560EVM DAC8560EVM 데이터 시트
제품 코드
DAC8560EVM
DAC Module
V
CC
V
SS
+ 3 .3 VA
V
CC
GND
GND
V
DD
DAC Out
( J1 )
( J5 )
( J6 )
( J5 )
( J6 )
( P 6)
External
Reference
Module
(J 2)
(P 2)
FSX
SCLK
TP 2
W 4
TP 1
V
SS
VREF H
SYNC
+ 5VA
DIN
(J 4)
(P 4)
TP 3
CS
GND
V
REF
H
W6
W2
W 7
W 3
W15
W 5
V
SS
SCLK
DIN
VOUT
VFB
VDD
+5 VA
+3 .3 VA
+3 .3 VA
W8
+4 V
+5V
W1
Output
Buffer
Module
PCB Design and Performance
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A block diagram of the EVM is shown in
Figure 1. EVM Block Diagram
2
PCB Design and Performance
This section discusses the layout design of the PCB, describes the physical and mechanical
characteristics of the EVM, and provides a brief description of the EVM test performance procedure. Also
included is the list of components used on this evaluation module.
characteristics of the EVM, and provides a brief description of the EVM test performance procedure. Also
included is the list of components used on this evaluation module.
2.1
PCB Layout
The DAC8560EVM is designed to preserve the performance quality of the DAC, device under test, as
specified in the data sheet. To take full advantage of the EVM's capabilities, use care during the
schematic design phase to properly select the right components and to build the circuit correctly. The
circuit should include adequate bypassing, identifying and managing the analog and digital signals, and
understanding the components' electrical and mechanical attributes.
specified in the data sheet. To take full advantage of the EVM's capabilities, use care during the
schematic design phase to properly select the right components and to build the circuit correctly. The
circuit should include adequate bypassing, identifying and managing the analog and digital signals, and
understanding the components' electrical and mechanical attributes.
The main design concern during the layout process is the optimal placement of components and the
proper routing of signals. Place the bypass capacitors as close as possible to the pins; properly separate
the analog and digital signals from each other. In the layout process, carefully consider the power and
ground plane because of their importance. A solid plane is ideally preferred, but because of its greater
cost, sometimes a split plane can be used satisfactorily. When considering a split plane design, analyze
the component placement and carefully split the board into its analog and digital sections starting from the
DUT. The ground plane plays an important role in controlling the noise and other effects that otherwise
contributes to the error of the DAC output. To ensure that the return currents are handled properly, route
the appropriate signals only in their respective sections, meaning that the analog traces should only lay
directly above or below the analog section and the digital traces in the digital section. Minimize the length
of the traces but use the biggest possible trace width allowable in the design. These design practices are
illustrated in
proper routing of signals. Place the bypass capacitors as close as possible to the pins; properly separate
the analog and digital signals from each other. In the layout process, carefully consider the power and
ground plane because of their importance. A solid plane is ideally preferred, but because of its greater
cost, sometimes a split plane can be used satisfactorily. When considering a split plane design, analyze
the component placement and carefully split the board into its analog and digital sections starting from the
DUT. The ground plane plays an important role in controlling the noise and other effects that otherwise
contributes to the error of the DAC output. To ensure that the return currents are handled properly, route
the appropriate signals only in their respective sections, meaning that the analog traces should only lay
directly above or below the analog section and the digital traces in the digital section. Minimize the length
of the traces but use the biggest possible trace width allowable in the design. These design practices are
illustrated in
through
.
The DAC8560EVM board is constructed on a four-layer printed-circuit board using a copper-clad FR-4
laminate material. The printed-circuit board has a dimension of 43,1800 mm (1.7000 inch) × 82,5500 mm
(3.2500 inch), and the board thickness is 1,5748 mm (0.062 inch).
laminate material. The printed-circuit board has a dimension of 43,1800 mm (1.7000 inch) × 82,5500 mm
(3.2500 inch), and the board thickness is 1,5748 mm (0.062 inch).
through
show the
individual artwork layers.
4
DAC8560 Evaluation Module
SLAU211A – March 2007 – Revised November 2009
Copyright © 2007–2009, Texas Instruments Incorporated