Texas Instruments Evaluation Module for TPS82672 600-mA, High-Efficiency MicroSiP Step-Down Converter TPS82672EVM-646 TPS82672EVM-646 데이터 시트
제품 코드
TPS82672EVM-646
TPS826xxEVM Assembly Drawings and Layout
6
TPS826xxEVM Assembly Drawings and Layout
through
show the design of the show the design of the TPS826xxEVM-646 printed
circuit boards. The EVM has been designed using a two-layer, 1-ounce copper-clad PCB with all
components in an active area on the top side of the board. Moving components to both sides of the PCB
or using additional internal layers can offer additional size reduction for space-constrained systems.
components in an active area on the top side of the board. Moving components to both sides of the PCB
or using additional internal layers can offer additional size reduction for space-constrained systems.
NOTE:
Board layouts are not to scale. These figures are intended to show how the board is laid out;
they are not intended to be used for manufacturing TPS826xxEVM-646 PCBs.
Note the connection of the TPS8267x feedback (FB) pin. It is recommended to connect the
FB pin directly to the inductor, not directly on the V
FB pin directly to the inductor, not directly on the V
OUT
connection of the output capacitor. The
connection to the inductor is recommended because it provides better transient response
performance.
performance.
Figure 5. TPS826xxEVM Component Placement (Top View)
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TPS826xxEVM
SLVU383D
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October 2010
–
Revised November 2011
Copyright
©
2010
–
2011, Texas Instruments Incorporated