Texas Instruments TPS59640EVM-751 Evaluation Module TPS59640EVM-751 TPS59640EVM-751 데이터 시트
제품 코드
TPS59640EVM-751
I
T
EXAS
NSTRUMENTS
EVM Assembly Drawings and PCB layout
Figure 91. TPS51916 Thermal
Test condition: 12Vin, 1.2 V/15 A, no airflow
9
EVM Assembly Drawings and PCB layout
The following figures (
through
) show the design of the TPS59640EVM-751
printed-circuit board. The EVM has been designed using an eight-layer circuit board with 2 oz o0f copper
on outside layers.
on outside layers.
Figure 92. TPS59640EVM-751 Top Layer Assembly Drawing (Top View)
53
SLUU796
–
January 2012
Using the TPS59640EVM-751 IMVP-7, 3-Phase CPU/1-Phase GPU SVID
Power System
Copyright
©
2012, Texas Instruments Incorporated