Texas Instruments DRV8412 Integrated Motor Driver for Brushed and Stepper Motors with Piccolo F28035 controlCARD DRV8412 DRV8412-C2-KIT 데이터 시트
제품 코드
DRV8412-C2-KIT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
GVDD_C
VDD
NC
NC
PWM_D
RESET_CD
PWM_C
OC_ADJ
GND
AGND
VREG
M3
M2
M1
PWM_B
RESET_AB
PWM_A
NC
FAULT
NC
OTW
GVDD_B
DRV8412
DDW Package
(Top View)
GVDD_D
BST_D
NC
PVDD_D
PVDD_D
PVDD_D
OUT_D
GND_D
GND_C
OUT_C
PVDD_C
BST_C
BST_B
PVDD_B
OUT_B
GND_B
GND_A
OUT_A
PVDD_A
PVDD_A
NC
BST_A
BST_A
GVDD_A
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
GVDD_B
FAULT
RESET_AB
RESET_CD
PWM_B
PWM_D
PWM_C
OTW
GND
PWM_A
AGND
OC_ADJ
M3
VDD
GVDD_C
VREG
M2
M1
GVDD_A
BST_A
PVDD_A
OUT_A
GND_A
GND_B
OUT_B
PVDD_B
BST_B
PVDD_C
BST_C
OUT_C
GND_C
GND_C
GND_D
OUT_D
PVDD_D
BST_D
GVDD_D
DRV8432
DKD Package
(Top View)
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
DEVICE INFORMATION
Pin Assignment
Here are the pinouts for the DRV8412/32:
•
•
DRV8412: 44-pin TSSOP power pad down DDW package. This package contains a thermal pad that is
located on the bottom side of the device for dissipating heat through PCB.
located on the bottom side of the device for dissipating heat through PCB.
•
DRV8432: 36-pin PSOP3 DKD package. This package contains a thick heat slug that is located on the top
side of the device for dissipating heat through heatsink.
side of the device for dissipating heat through heatsink.
PIN FUNCTIONS
PIN
DESCRIPTION
NAME
DRV8412
DRV8432
FUNCTION
(1)
AGND
12
9
P
Analog ground
BST_A
24
35
P
High side bootstrap supply (BST), external capacitor to OUT_A required
BST_B
33
28
P
High side bootstrap supply (BST), external capacitor to OUT_B required
BST_C
34
27
P
High side bootstrap supply (BST), external capacitor to OUT_C required
BST_D
43
20
P
High side bootstrap supply (BST), external capacitor to OUT_D required
GND
13
8
P
Ground
GND_A
29
32
P
Power ground for half-bridge A requires close decoupling capacitor to ground
GND_B
30
31
P
Power ground for half-bridge B requires close decoupling capacitor to ground
GND_C
37
24
P
Power ground for half-bridge C requires close decoupling capacitor to ground
GND_D
38
23
P
Power ground for half-bridge D requires close decoupling capacitor to ground
GVDD_A
23
36
P
Gate-drive voltage supply
GVDD_B
22
1
P
Gate-drive voltage supply
GVDD_C
1
18
P
Gate-drive voltage supply
GVDD_D
44
19
P
Gate-drive voltage supply
M1
8
13
I
Mode selection pin
(1)
I = input, O = output, P = power, T = thermal
4
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