Texas Instruments TLV62080EVM-756 Evaluation Module TLV62080EVM-756 TLV62080EVM-756 데이터 시트
제품 코드
TLV62080EVM-756
SLVSAK9E – OCTOBER 2011 – REVISED FEBRUARY 2014
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Documentation Support
For related documentation see the following:
•
•
TLV62080EVM-756 User's Guide, TLV62080, 1.2-A, High-Efficiency, Step-Down Converter in 2-mm × 2-mm
SON Package,
SON Package,
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
resources, tools and software, and quick access to sample or buy.
Table 7. Related Links
TECHNICAL
TOOLS &
SUPPORT &
PARTS
PRODUCT FOLDER
SAMPLE & BUY
DOCUMENTS
SOFTWARE
COMMUNITY
TLV62080
TLV62084
12.4 Trademarks
DCS-Control is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
— TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
Copyright © 2011–2014, Texas Instruments Incorporated
Product Folder Links: