Texas Instruments F28M36 Concerto Control Card TMDSCNCD28M36 TMDSCNCD28M36 데이터 시트
제품 코드
TMDSCNCD28M36
SPRS825C – OCTOBER 2012 – REVISED FEBRUARY 2014
6.2
Thermal Design Considerations
Based on the end-application design and operational profile, the I
DD12
, I
DD18
, and I
DDIO
currents could vary.
Systems that exceed the recommended maximum power dissipation in the end product may require
additional thermal enhancements. Ambient temperature (T
additional thermal enhancements. Ambient temperature (T
A
) varies with the end application and product
design. The critical factor that affects reliability and functionality is T
J
, the junction temperature, not the
ambient temperature. Hence, care should be taken to keep T
J
within the specified limits. T
case
should be
measured to estimate the operating junction temperature T
J
. T
case
is normally measured at the center of
the package top-side surface. For more details about thermal metrics and definitions, see the
Semiconductor and IC Package Thermal Metrics Application Report (literature number
Semiconductor and IC Package Thermal Metrics Application Report (literature number
) and the
Reliability Data for TMS320LF24xx and TMS320F28xx Devices Application Report (literature number
130
Electrical Specifications
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