Texas Instruments LM49370RLEVAL Evaluation Board LM49370RLEVAL/NOPB LM49370RLEVAL/NOPB 데이터 시트
제품 코드
LM49370RLEVAL/NOPB
SNAS356D – FEBRUARY 2007 – REVISED MARCH 2012
Pin Descriptions (continued)
Pin
Pin Name
Type
Direction
Description
E7
I2S_SDI
Digital
Input
I2S Serial Data Input
F1
HP_VMID_FB
Analog
Input
VMID Feedback in OCL
mode, otherwise a 2nd
headset detection input
mode, otherwise a 2nd
headset detection input
F2
LS_V
DD
Supply
Input
Loudspeaker V
DD
F3
CPI_POS
Analog
Input
Cell Phone analog input
positive
positive
F4
CPO_NEG
Analog
Output
Cell Phone analog output
negative
negative
F5
AUX_OUT_NEG
Analog
Output
Auxiliary analog output
negative
negative
F6
I2S_WS
Digital
Inout
I2S Word Select Signal
(can be master or slave)
(can be master or slave)
F7
I2S_CLK
Digital
Inout
I2S Clock Signal (can be
master or slave)
master or slave)
G1
LS_NEG
Analog
Output
Loudspeaker negative
output
output
G2
LS_V
SS
Supply
Input
Loudspeaker ground
G3
LS_POS
Analog
Output
Loudspeaker positive
output
output
G4
CPO_POS
Analog
Output
Cell Phone analog output
positive
positive
G5
AUX_OUT_POS
Analog
Output
Auxiliary analog output
positive
positive
G6
D_V
SS
Supply
Input
Digital ground
G7
MCLK
Digital
Input
Input clock from 0.5 MHz
to 30 MHz
to 30 MHz
PIN TYPE DEFINITIONS
Analog Input— A pin that is used by the analog and is never driven by the device. Supplies are part of this
classification.
Analog Output— A pin that is driven by the device and should not be driven by external sources.
Analog Inout— A pin that is typically used for filtering a DC signal within the device, Passive components can be
connected to these pins.
Digital Input— A pin that is used by the digital but is never driven.
Digital Output— A pin that is driven by the device and should not be driven by another device to avoid
contention.
Digital Inout— A pin that is either open drain (I2C_SDA) or a bidirectional CMOS in/out. In the later case the
direction is selected by a control register within the LM49370.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
during storage or handling to prevent electrostatic damage to the MOS gates.
Copyright © 2007–2012, Texas Instruments Incorporated
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