Texas Instruments ISO1176T Small EVM ISO1176TEVM-433 ISO1176TEVM-433 데이터 시트
제품 코드
ISO1176TEVM-433
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2.3
PCB Layout and Construction
The ISO1176/35T/3086TEVM PCB is a 4-layer board. The top and bottom layers (
and
) contain signal routing. The remaining layers (
and
) are power and ground
planes. These are split planes to keep the Vcc1/GND1 separate from Vcc2/GND2. The I/O traces are
designed to have a characteristic impedance of 50
designed to have a characteristic impedance of 50
Ω
.
Figure 10. PCB Top Layer
12
ISO1176T/35T/3086T Evaluation Module
SLLU122A – April 2010 – Revised July 2010
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