Texas Instruments TPS81256EVM-121 3W High-Efficiency Step-up Converter in MicroSiP package Evaluation Module TPS81256EVM TPS81256EVM-121 데이터 시트

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TPS81256EVM-121

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TPS8125xEVM Printed Circuit Board Layout

TPS8125xEVM Printed Circuit Board Layout

Figure 2

through

Figure 6

show the design of the TPS8125xEVM-121 printed circuit board (PCB). The

EVM has been designed using a four-layer PCB with all components on the top side of the board. Moving
components to both sides of the PCB can offer additional size reduction for space-constrained systems.
All the following images are viewed from the top of the PCB.

Figure 2. TPS8125xEVM Component Placement

SLVU653 – April 2012

TPS8125xEVM

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