Texas Instruments TLK10002SMAEVM Evaluation Module TLK10002SMAEVM TLK10002SMAEVM 데이터 시트
제품 코드
TLK10002SMAEVM
TLK10002EVM SMA Breakout Board Layout
Table 6. TLK10002EVM SMA Breakout Board Layer Construction
SUBCLASS
THICKNESS
DIELECTRIC
LOSS
WIDTH
COUPLING TYPE/SPACING
IMPEDANCE
(1)
TYPE
MATERIAL
NAME
(MIL)
CONSTANT
TANGENT
(MIL)
(MIL)
(
Ω
)
SURFACE
AIR
1
0
TOP
CONDUCTOR
COPPER
1.96
4.1
0
6.00
Edge/5.00
97.298
DIELECTRIC
FR-4
5
4.1
0.035
L2_GND1
PLANE
COPPER
1.2
1
0
DIELECTRIC
FR-4
5
4.1
0.035
L3_GND2
PLANE
COPPER
1.2
1
0
DIELECTRIC
FR-4
4
4.1
0.035
L4_GND3
PLANE
COPPER
1.2
1
0
DIELECTRIC
FR-4
20
4.1
0.035
L13_GND4
PLANE
COPPER
1.2
1
0
DIELECTRIC
FR-4
5
4.1
0.035
BOTTOM
CONDUCTOR
COPPER
1.96
1
0
9.50
NONE/NONE
48.425
SURFACE
AIR
(1)
The Impedance is set to be slightly less than 50
Ω
or 100
Ω
on the traces in order to compensate for slight over-etching during the
manufacturing process. The end impedance after etching should result in a 50 or 100-
Ω
Impedance. Always consult with your board
manufacturer for their process/design requirements to ensure the desired impedance is achieved.
92
TLK10002 Dual-Channel, 10-Gbps, Multi-Rate Transceiver Evaluation Module
SLLU148
–
May 2011
Copyright
©
2011, Texas Instruments Incorporated