Texas Instruments TPS386040EVM Evaluation Module TPS386040EVM TPS386040EVM 데이터 시트
제품 코드
TPS386040EVM
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7 EVM Assembly Drawings and Layout Guidelines
7.2
Layouts Guidelines
Thermal pad
The thermal pad provides a thermal and mechanical interface between the device and the printed circuit
board (PCB). Connect the exposed thermal pad of the PCB to the device VSS pins and provide at least a
3 x 3 pattern of PCB vias to connect the thermal pad and GND pin to the circuit ground on other PCB
layers.
board (PCB). Connect the exposed thermal pad of the PCB to the device VSS pins and provide at least a
3 x 3 pattern of PCB vias to connect the thermal pad and GND pin to the circuit ground on other PCB
layers.
Supply voltage decoupling
Provide power supply pin bypass to the device as follows:
•
0.1µF, X7R ceramic at pin 15 (VCC)
•
1nF, X7R ceramic at pins 6-10 (SENSE1, SENSE2, SENSE3, SENSE4L, SENSE4H) while not
absolutely required can provide noise filtering in noisy power supply systems.
absolutely required can provide noise filtering in noisy power supply systems.
15
SLVU341 – October 2009
Evaluation Module for TPS386000 and TPS386040
Copyright © 2009, Texas Instruments Incorporated