Texas Instruments IC MCU 16B MSP430F2232TDA TSSOP-38 TID MSP430F2232TDA 데이터 시트
제품 코드
MSP430F2232TDA
4.15 MHz
12 MHz
16 MHz
1.8 V
2.2 V
2.7 V
3.3 V
3.6 V
Supply Voltage −V
S
y
s
te
m
F
re
q
u
e
n
c
y
−
M
H
z
Supply voltage range,
during flash memory
programming
during flash memory
programming
Supply voltage range,
during program execution
during program execution
Legend :
7.5 MHz
MSP430F22x2
MSP430F22x4
MSP430F22x4
SLAS504G – JULY 2006 – REVISED AUGUST 2012
Absolute Maximum Ratings
(1)
Voltage applied at V
CC
to V
SS
-0.3 V to 4.1 V
Voltage applied to any pin
(2)
-0.3 V to V
CC
+ 0.3 V
Diode current at any device terminal
±2 mA
Unprogrammed device
-55°C to 150°C
Storage temperature, T
stg
(3)
Programmed device
-55°C to 150°C
(1)
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
(3)
Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
(1) (2)
MIN
NOM
MAX
UNIT
During program
1.8
3.6
V
execution
V
CC
Supply voltage
AV
CC
= DV
CC
= V
CC
During program/erase
2.2
3.6
V
flash memory
V
SS
Supply voltage
AV
SS
= DV
SS
= V
SS
0
V
I version
-40
85
T
A
Operating free-air temperature
°C
T version
-40
105
V
CC
= 1.8 V, Duty cycle = 50% ±10%
dc
4.15
Processor frequency
f
SYSTEM
(maximum MCLK frequency)
(1) (2)
V
CC
= 2.7 V, Duty cycle = 50% ±10%
dc
12
MHz
(see
V
CC
≥
3.3 V, Duty cycle = 50% ±10%
dc
16
(1)
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
specified maximum frequency.
(2)
Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V
CC
of 2.2 V.
Figure 1. Operating Area
26
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