Texas Instruments DAC8832EVM-PDK - DAC8832 Performance Demonstration Kit DAC8832EVM-PDK DAC8832EVM-PDK 데이터 시트
제품 코드
DAC8832EVM-PDK
PCB Design and Performance
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1.4
Related Documentation from Texas Instruments
To obtain a copy of any of the following TI documents, call the Texas Instruments Literature Response
Center at (800) 477–8924 or the Product Information Center (PIC) at (972) 644–5580. When ordering,
identify this manual by its title and literature number. Updated documents can also be obtained through
our website at
Center at (800) 477–8924 or the Product Information Center (PIC) at (972) 644–5580. When ordering,
identify this manual by its title and literature number. Updated documents can also be obtained through
our website at
.
Related Documentation
Data Sheet
Literature Number
DAC8831
DAC8832
OPA735
OPA353
REF3025
1.5
Questions About This or Other Data Converter EVMs
If you have questions about this or other Texas Instruments Data Converter evaluation modules, feel free
to e-mail the Data Converter Application Team at
to e-mail the Data Converter Application Team at
. Include in the subject
heading the product you have questions or concerns with.
2
PCB Design and Performance
This section talks about the layout design of the PCB describing the physical and mechanical
characteristics of the EVM. It shows the resulting performance of the EVM, which can be compared to the
device specification listed in the datasheet. The list of components used on the module is also included in
this section.
characteristics of the EVM. It shows the resulting performance of the EVM, which can be compared to the
device specification listed in the datasheet. The list of components used on the module is also included in
this section.
2.1
PCB Layout
The DAC8831/32EVM is designed to demonstrate the performance quality of the installed DAC device
under test, as specified in the datasheet. Careful analysis of the EVM’s physical restrictions and factors
that contributes to the EVM performance degradation is the key to a successful design implementation.
The obvious attributes that contributes to the poor performance of the EVM can be avoided during the
schematic design phase by properly selecting the right components and designing the circuit correctly.
The circuit should include adequate bypassing, identifying and managing the analog and digital signals
and knowing or understanding the components mechanical attributes.
under test, as specified in the datasheet. Careful analysis of the EVM’s physical restrictions and factors
that contributes to the EVM performance degradation is the key to a successful design implementation.
The obvious attributes that contributes to the poor performance of the EVM can be avoided during the
schematic design phase by properly selecting the right components and designing the circuit correctly.
The circuit should include adequate bypassing, identifying and managing the analog and digital signals
and knowing or understanding the components mechanical attributes.
The obscure part of the design lies particularly in the layout process. The main concern is primarily with
the placement of components and the proper routing of signals. The bypass capacitors should be placed
as close as possible to the pins and the analog and digital signals should be properly separated from each
other. The power and ground plane is very important and should be carefully considered in the layout
process. A solid plane is ideally preferred but sometimes impractical, so when solid planes are not
possible, a split plane will do the job as well. When considering a split plane design, analyze the
component placement and carefully split the board into its analog and digital sections starting from the
device under test. The ground plane plays an important role in controlling the noise and other effects that
otherwise contributes to the error of the DAC output. To ensure that the return currents are handled
properly, route the appropriate signals only in their respective sections; meaning, the analog traces should
only be placed in the analog section, and the digital traces in the digital section. Minimize the length of the
traces but use the biggest possible trace width allowable in the design. These design practice discussed
can be seen in the following figures presented below.
the placement of components and the proper routing of signals. The bypass capacitors should be placed
as close as possible to the pins and the analog and digital signals should be properly separated from each
other. The power and ground plane is very important and should be carefully considered in the layout
process. A solid plane is ideally preferred but sometimes impractical, so when solid planes are not
possible, a split plane will do the job as well. When considering a split plane design, analyze the
component placement and carefully split the board into its analog and digital sections starting from the
device under test. The ground plane plays an important role in controlling the noise and other effects that
otherwise contributes to the error of the DAC output. To ensure that the return currents are handled
properly, route the appropriate signals only in their respective sections; meaning, the analog traces should
only be placed in the analog section, and the digital traces in the digital section. Minimize the length of the
traces but use the biggest possible trace width allowable in the design. These design practice discussed
can be seen in the following figures presented below.
The DAC8831/32EVM board is constructed on a two-layer printed circuit board using a copper-clad FR-4
laminate material. The printed circuit board has a dimension of 43,1800 mm (1.7000 inch) × 82,5500 mm
(3.2000 inch), and the board thickness is 1,5748 mm (0.0620 inch).
laminate material. The printed circuit board has a dimension of 43,1800 mm (1.7000 inch) × 82,5500 mm
(3.2000 inch), and the board thickness is 1,5748 mm (0.0620 inch).
through
show the
individual artwork layers.
4
DAC8831/32 Evaluation Module
SLAU202A – December 2006 – Revised November 2009
Copyright © 2006–2009, Texas Instruments Incorporated