Microchip Technology DM300023 데이터 시트

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dsPIC30F1010/202X
DS70178C-page 232
Preliminary
©
 2006 Microchip Technology Inc.
   
TABLE 21-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
dsPIC30F1010/202X-30I
Operating Junction Temperature Range
T
J
-40
+125
°C
Operating Ambient Temperature Range
T
A
-40
+85
°C
dsPIC30F1010/202X-20E
Operating Junction Temperature Range
T
J
-40
+150
°C
Operating Ambient Temperature Range
T
A
-40
+125
°C
Power Dissipation:
Internal chip power dissipation:
 
 
P
D
P
INT
 + P
I
/
O
W
I/O Pin power dissipation:
 
Maximum Allowed Power Dissipation
P
DMAX
(T
J
 - T
A
) / 
θ
JA
W
TABLE 21-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 28-pin SOIC (SO)
θ
JA
48.3
°C/W
1, 2
Package Thermal Resistance, 28-pin QFN
θ
JA
33.7
°C/W
1, 2
Package Thermal Resistance, 28-pin SPDIP (SP)
θ
JA
42
°C/W
1, 2
Package Thermal Resistance, 44-pin QFN
θ
JA
 28
°C/W
1, 2
Package Thermal Resistance, 44-pin TQFP
θ
JA
 39.3
°C/W
1, 2
Note 1:
Junction to ambient thermal resistance, Theta-ja (
θ
JA
) numbers are achieved by package simulations.
2:
Depending on operating conditions, air flow may be required for improved thermal performance.
TABLE 21-4:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature
-40°C
 
≤ 
T
A
 
≤ 
+85°C for Industrial
 
-40
°
C
 
≤ 
T
A
 
≤ 
+125°C for Extended 
Param 
No. 
Symbol
Characteristic
Min
Typ
(1)
Max
Units
Conditions
Operating Voltage
(2)
DC10
V
DD
Supply Voltage
3.0
5.5
V
Industrial temperature
DC11
V
DD
Supply Voltage
3.0
5.5
V
Extended temperature
DC12
V
DR
RAM Data Retention Voltage
(3)
1.5
V
DC16
V
POR
V
DD
 Start Voltage
to ensure internal
Power-on Reset signal
V
SS
V
DC17
S
VDD
V
DD
 Rise Rate
to ensure internal
Power-on Reset signal
0.05 
V/ms 0-5V in 0.1 sec
0-3.3V in 60 ms
Note 1:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and 
are not tested.
2:
These parameters are characterized but not tested in manufacturing.
3:
This is the limit to which V
DD
 can be lowered without losing RAM data.
P
INT
V
D D
I
D D
I
O H
(
)
×
=
P
I
/
O
V
D D
V
O H
{
} I
OH
×
(
)
V
O L
I
O L
×
(
)
+
=