Microchip Technology DM164134 데이터 시트

DS41159E-page 380

© 2006 Microchip Technology Inc.

For the most current package drawings, please see the Microchip Packaging Specification located at 
http://www.microchip.com/packaging

Foot Angle Top

φ

0

4

8

0

4

8

15

12

0

15

12

0

β

Mold Draft Angle Bottom

15

12

0

15

12

0

α

Mold Draft Angle Top

0.51

0.42

0.36

.020

.017

.014

B

Lead Width

0.33

0.28

0.23

.013

.011

.009

c

Lead Thickness

1.27

0.84

0.41

.050

.033

.016

L

Foot Length

0.74

0.50

0.25

.029

.020

.010

h

Chamfer Distance

18.08

17.87

17.65

.712

.704

.695

D

Overall Length

7.59

7.49

7.32

.299

.295

.288

E1

Molded Package Width

10.67

10.34

10.01

.420

.407

.394

E

Overall Width

0.30

0.20

0.10

.012

.008

.004

A1

Standoff

2.39

2.31

2.24

.094

.091

.088

A2

Molded Package Thickness

2.64

2.50

2.36

.104

.099

.093

A

Overall Height

1.27

.050

p

Pitch

28

28

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

2
1

D

p

n

B

E

E1

L

c

β

45

°

h

φ

A2

α

A

A1

 Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. 
JEDEC Equivalent:  MS-013
Drawing No. C04-052

Significant Characteristic