Freescale Semiconductor FRDM-FXS-MULTI 데이터 시트
PCB land pad
Solder stencil opening
24X 0.8
24X 0.3
20X 0.5
4X 2.175
Solder mask opening
4X 1.438
4.576
4X 1.938
4.576
Package
24X 0.769
24X 0.269
20X 0.5
4X 2.160
Package outline
Package outline
4
12
8
24X 0.30
0.18
4
24X 0.725
0.525
7
1
20
24
13
19
20X 0.5
Package outline
Figure 18. Footprint
7.2 Overview of Soldering Considerations
The information provided here is based on experiments executed on QFN devices.
These experiments cannot represent exact conditions present at a customer site.
Therefore, information herein should be used for guidance purposes only. Process and
design optimizations are recommended to develop an application-specific solution.
With the proper PCB footprint and solder stencil designs, the package will self-align
during the solder reflow process.
These experiments cannot represent exact conditions present at a customer site.
Therefore, information herein should be used for guidance purposes only. Process and
design optimizations are recommended to develop an application-specific solution.
With the proper PCB footprint and solder stencil designs, the package will self-align
during the solder reflow process.
• Stencil thickness should be 100 or 125 µm.
• The PCB should be rated for the multiple lead-free reflow condition with a
• The PCB should be rated for the multiple lead-free reflow condition with a
maximum 260 °C temperature.
Printed Circuit Board Layout and Device Mounting
Xtrinsic 3-Axis Digital Angular Rate Gyroscope, Rev1.2, 7/2014.
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Freescale Semiconductor, Inc.