Linear Technology DC1238B - LTM8021EV Demoboard DC1238B DC1238B 데이터 시트
제품 코드
DC1238B
LTM8021
15
8021fd
package DescripTion
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.
6.250
BSC
PACKAGE TOP VIEW
11.250
BSC
4
PAD 1
CORNER
X Y
aaa Z
aaa Z
2.72 – 2.92
DETAIL A
PACKAGE SIDE VIEW
DETAIL A
SUBSTRATE
MOLD
CAP
0.27 – 0.37
2.40 – 2.60
bbb Z
Z
LGA 35 0113 REV B
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
4.445
4.445
3.175
3.175
1.905
0.0000
1.905
0.635
0.635
1.270
1.270
0.9525
1.5875
1.5875
0.635
0.9525
0.3175
2.540
2.540
SUGGESTED PCB LAYOUT
TOP VIEW
0.0000
LGA Package
35-Lead (11.25mm
× 6.25mm × 2.82mm)
(Reference LTC DWG # 05-08-1805 Rev B)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 35
6. THE TOTAL NUMBER OF PADS: 35
4
3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A
MARKED FEATURE
SYMBOL
aaa
bbb
TOLERANCE
0.15
0.10
0.10
7
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
PADS
SEE NOTES
1.270
BSC
0.605 – 0.665
0.605 – 0.665
8.890
BSC
5.080
BSC
PAD 1
C (0.30)
H
B
A
D
C
5
1
3
2
3
4
E
F
PACKAGE BOTTOM VIEW
G
7
SEE NOTES