Atmel Xplained Evaluation Board AT32UC3A3-XPLD AT32UC3A3-XPLD 데이터 시트
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제품 코드
AT32UC3A3-XPLD
988
32072H–AVR32–10/2012
AT32UC3A3
37. Mechanical Characteristics
37.1
Thermal Considerations
37.1.1
Thermal Data
summarizes the thermal resistance data depending on the package.
37.1.2
Junction Temperature
The average chip-junction temperature, T
J
, in °C can be obtained from the following:
1.
2.
where:
•
θ
JA
= package thermal resistance, Junction-to-ambient (°C/W), provided in
•
θ
JC
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
.
•
θ
HEAT SINK
= cooling device thermal resistance (°C/W), provided in the device datasheet.
• P
D
.
• T
A
= ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
J
in °C.
Table 37-1.
Thermal Resistance Data
Symbol
Parameter
Condition
Package
Typ
Unit
θ
JA
Junction-to-ambient thermal resistance
Still Air
TQFP144
40.3
°
C/W
θ
JC
Junction-to-case thermal resistance
TQFP144
9.5
θ
JA
Junction-to-ambient thermal resistance
Still Air
TFBGA144
28.5
°
C/W
θ
JC
Junction-to-case thermal resistance
TFBGA144
6.9
θ
JA
Junction-to-ambient thermal resistance
Still Air
VFBGA100
31.1
°
C/W
θ
JC
Junction-to-case thermal resistance
VFBGA100
6.9
T
J
T
A
P
D
θ
JA
×
(
)
+
=
T
J
T
A
P
(
D
θ
(
HEATSINK
×
θ
JC
) )
+
+
=