Manualsbrain.com
  1. 매뉴얼
  2. 브랜드
  3. Linear Technology
  4. DC1379B - LTM8025EV Demo Board | 36Vin , 3A Step Down μModule Converter DC1379B
  5. 데이터 시트

Linear Technology DC1379B - LTM8025EV Demo Board | 36Vin , 3A Step Down μModule Converter DC1379B DC1379B 데이터 시트

제품 코드
DC1379B
다운로드
페이지 중 22
LTM8025
2
8025fc
For more information 
www.linear.com/LTM8025
absoluTe MaxiMuM raTings
V
IN
, RUN/SS Voltage .................................................36V
ADJ, RT, SHARE Voltage .............................................6V
V
OUT
, AUX .................................................................25V
PGOOD, SYNC...........................................................30V
(Note 1)
orDer inForMaTion
pin conFiguraTion
GND
1
A
B
C
BANK 1
BANK 2
BANK 3
D
E
F
G
H
J
K
L
2
3
4
LGA PACKAGE
70-PIN (9mm 
× 15mm × 4.32mm)
5
6
7
V
OUT
V
IN
RT
SHARE
PGOOD
ADJ
SYNC
RUN/SS
AUX
BIAS
 
T
JMAX
 = 125°C, 
θ
JA
 = 24.4°C/W, 
θ
JC(BOTTOM)
 = 11.5°C/W,  
θ
JC(TOP)
 = 42.7°C/W, 
θ
JB
 = 18.7°C/W 
θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER 
WEIGHT = 1.8 GRAMS
1
A
B
C
BANK 1
BANK 2
AUX
BIAS
BANK 3
D
E
F
G
H
J
K
L
2
3
V
OUT
GND
RT
SHARE
PGOOD
ADJ
SYNC
RUN/SS
V
IN
4
BGA PACKAGE
70-PIN (9mm 
× 15mm × 4.92mm)
5
6
7
 
T
JMAX
 = 125°C, 
θ
JA
 = 24.4°C/W, 
θ
JC(BOTTOM)
 = 11.5°C/W,  
θ
JC(TOP)
 = 42.7°C/W, 
θ
JB
 = 18.7°C/W 
θ VALUES DETERMINED PER JESD51-9, MAX OUTPUT POWER 
WEIGHT = 1.8 GRAMS
BIAS ..........................................................................25V
V
IN
 + BIAS .................................................................56V
Maximum Junction Temperature (Note 2) ............ 125°C
Solder Temperature ............................................... 245°C
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
PACKAGE  
TYPE
MSL  
RATING
TEMPERATURE RANGE 
(Note 2)
DEVICE 
FINISH CODE
LTM8025EV#PBF
Au (RoHS)
LTM8025V
e4
LGA
3
–40°C to 125°C
LTM8025IV#PBF
Au (RoHS)
LTM8025V
e4
LGA
3
–40°C to 125°C
LTM8025MPV#PBF
Au (RoHS)
LTM8025MPV
e4
LGA
3
–55°C to 125°C
LTM8025EY#PBF
SAC305 (RoHS)
LTM8025Y
e1
BGA
3
–40°C to 125°C
LTM8025IY#PBF
SAC305 (RoHS)
LTM8025Y
e1
BGA
3
–40°C to 125°C
LTM8025IY
SnPb (63/37)
LTM8025Y
e0
BGA
3
–40°C to 125°C
LTM8025MPY#PBF
SAC305 (RoHS)
LTM8025Y
e1
BGA
3
–55°C to 125°C
LTM8025MPY
SnPb (63/37)
LTM8025Y
e0
BGA
3
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature 
ranges. *Device temperature grade is indicated by a label on the shipping 
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking: 
• Recommended LGA and BGA PCB Assembly and Manufacturing 
Procedures: 
• LGA and BGA Package and Tray Drawings: