AMD Sempron™ Processor-In-a-Box 3100+ 사용자 매뉴얼

차례

• 1 Overview

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  • 1.1 QuantiSpeed™ Architecture Summary

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• 2 Interface Signals

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  • 2.1 Overview

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  • 2.2 Signaling Technology

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  • 2.3 Push-Pull (PP) Drivers

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  • 2.4 AMD Athlon™ System Bus Signals

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• 3 Logic Symbol Diagram

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• 4 Power Management

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  • 4.1 Power Management States

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  • 4.2 Connect and Disconnect Protocol

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  • 4.3 Clock Control

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• 5 CPUID Support

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• 6 333 FSB AMD Sempron™ Processor Model 10 Specifications

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  • 6.1 Electrical and Thermal Specifications for the 333 FSB AMD Sempron™ Processor Model 10

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  • 6.2 333 FSB AMD Sempron™ Processor Model 10 SYSCLK and SYSCLK# AC Characteristics

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  • 6.3 333 FSB AMD Athlon™ System Bus AC Characteristics

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  • 6.4 333 FSB AMD Athlon™ System Bus DC Characteristics

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• 7 Electrical Data

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  • 7.1 Conventions

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  • 7.2 Interface Signal Groupings

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  • 7.3 Voltage Identification (VID[4:0])

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  • 7.4 Frequency Identification (FID[3:0])

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  • 7.5 VCCA AC and DC Characteristics

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  • 7.6 Decoupling

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  • 7.7 VCC_CORE Characteristics

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  • 7.8 Absolute Ratings

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  • 7.9 SYSCLK and SYSCLK# DC Characteristics

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  • 7.10 General AC and DC Characteristics

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  • 7.11 Open Drain Test Circuit

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  • 7.12 Thermal Diode Characteristics

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  • 7.13 APIC Pins AC and DC Characteristics

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• 8 Signal and Power-Up Requirements

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  • 8.1 Power-Up Requirements

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  • 8.2 Processor Warm Reset Requirements

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• 9 Mechanical Data

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  • 9.1 Die Loading

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  • 9.2 AMD Sempron™ Processor Model 10 Part Number 27488 OPGA Package Dimensions

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  • 9.3 AMD Sempron™ Processor Model 10 Part Number 27493 OPGA Package Dimensions

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• 10 Pin Descriptions

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  • 10.1 Pin Diagram and Pin Name Abbreviations

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  • 10.2 Pin List

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  • 10.3 Detailed Pin Descriptions

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• 11 Ordering Information

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