Intel 4 662 사용자 매뉴얼

차례

• 1 Introduction

  11
  • 1.1 Terminology

    12
    • 1.1.1 Processor Packaging Terminology

      13
  • 1.2 References

    14
• 2 Electrical Specifications

  15
  • 2.1 FSB and GTLREF

    15
  • 2.2 Power and Ground Lands

    15
  • 2.3 Decoupling Guidelines

    15
    • 2.3.1 VCC Decoupling

      16
    • 2.3.2 FSB GTL+ Decoupling

      16
    • 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking

      16
  • 2.4 Voltage Identification

    17
    • 2.4.1 Phase Lock Loop (PLL) Power and Filter

      19
  • 2.5 Reserved, Unused, FC, and TESTHI Signals

    20
  • 2.6 FSB Signal Groups

    20
  • 2.7 GTL+ Asynchronous Signals

    22
  • 2.8 Test Access Port (TAP) Connection

    22
  • 2.9 FSB Frequency Select Signals (BSEL[2:0])

    23
  • 2.10 Absolute Maximum and Minimum Ratings

    23
  • 2.11 Processor DC Specifications

    24
  • 2.12 VCC Overshoot Specification

    33
    • 2.12.1 Die Voltage Validation

      33
  • 2.13 GTL+ FSB Specifications

    34
• 3 Package Mechanical Specifications

  35
  • 3.1 Package Mechanical Drawing

    35
  • 3.2 Processor Component Keep-Out Zones

    39
  • 3.3 Package Loading Specifications

    39
  • 3.4 Package Handling Guidelines

    39
  • 3.5 Package Insertion Specifications

    40
  • 3.6 Processor Mass Specification

    40
  • 3.7 Processor Materials

    40
  • 3.8 Processor Markings

    40
  • 3.9 Processor Land Coordinates

    41
• 4 Land Listing and Signal Descriptions

  43
  • 4.1 Processor Land Assignments

    43
  • 4.2 Alphabetical Signals Reference

    66
• 5 Thermal Specifications and Design Considerations

  75
  • 5.1 Processor Thermal Specifications

    75
    • 5.1.1 Thermal Specifications

      75
    • 5.1.2 Thermal Metrology

      79
  • 5.2 Processor Thermal Features

    79
    • 5.2.1 Thermal Monitor

      79
    • 5.2.2 Thermal Monitor 2

      80
    • 5.2.3 On-Demand Mode

      82
    • 5.2.4 PROCHOT# Signal

      82
    • 5.2.5 THERMTRIP# Signal

      83
    • 5.2.6 TCONTROL and Fan Speed Reduction

      83
    • 5.2.7 Thermal Diode

      83
• 6 Features

  85
  • 6.1 Power-On Configuration Options

    85
  • 6.2 Clock Control and Low Power States

    86
    • 6.2.1 Normal State

      86
    • 6.2.2 HALT and Enhanced HALT Powerdown States

      87
      • 6.2.2.1 HALT Powerdown State

        87
      • 6.2.2.2 Enhanced HALT Powerdown State

        88
    • 6.2.3 Stop-Grant State

      88
    • 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State

      88
    • 6.2.5 HALT Snoop State, Grant Snoop State

      89
      • 6.2.5.1 Enhanced HALT Snoop State

        89
    • 6.2.6 Enhanced Intel SpeedStep® Technology

      89
• 7 Boxed Processor Specifications

  91
  • 7.1 Mechanical Specifications

    92
    • 7.1.1 Boxed Processor Cooling Solution Dimensions

      92
    • 7.1.2 Boxed Processor Fan Heatsink Weight

      93
    • 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      93
  • 7.2 Electrical Requirements

    93
    • 7.2.1 Fan Heatsink Power Supply

      93
  • 7.3 Thermal Specifications

    95
    • 7.3.1 Boxed Processor Cooling Requirements

      95
    • 7.3.2 Variable Speed Fan

      96
• 8 Balanced Technology Extended (BTX) Type I Boxed Processor Specifications

  99
  • 8.1 Mechanical Specifications

    100
    • 8.1.1 Cooling Solution Dimensions

      100
    • 8.1.2 Boxed Processor Fan Heatsink Weight

      100
    • 8.1.3 Boxed Processor Support and Retention Module (SRM)

      101
  • 8.2 Electrical Requirements

    101
    • 8.2.1 Fan Heatsink Power Supply

      101
  • 8.3 Thermal Specifications

    103
    • 8.3.1 Boxed Processor Cooling Requirements

      103
    • 8.3.2 Variable Speed Fan

      104