Intel Core i7 Processor I7-940 사용자 매뉴얼

차례

• Intel® Core™ i7 Processor Extreme Edition and Intel® Core™ i7 Processor

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• Contents

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• Figures

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• Tables

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• Intel® Core™ i7 Processor Extreme Edition and Intel® Core™ i7 Processor Features

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• Revision History

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• 1 Introduction

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  • 1.1 Terminology

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  • 1.2 References

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• 2 Electrical Specifications

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  • 2.1 Intel® QPI Differential Signaling

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  • 2.2 Power and Ground Lands

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  • 2.3 Decoupling Guidelines

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    • 2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling

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  • 2.4 Processor Clocking (BCLK_DP, BCLK_DN)

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    • 2.4.1 PLL Power Supply

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  • 2.5 Voltage Identification (VID)

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  • 2.6 Reserved or Unused Signals

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  • 2.7 Signal Groups

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  • 2.8 Test Access Port (TAP) Connection

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  • 2.9 Platform Environmental Control Interface (PECI) DC Specifications

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    • 2.9.1 DC Characteristics

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    • 2.9.2 Input Device Hysteresis

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  • 2.10 Absolute Maximum and Minimum Ratings

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  • 2.11 Processor DC Specifications

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    • 2.11.1 DC Voltage and Current Specification

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    • 2.11.2 VCC Overshoot Specification

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    • 2.11.3 Die Voltage Validation

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• 3 Package Mechanical Specifications

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  • 3.1 Package Mechanical Drawing

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  • 3.2 Processor Component Keep-Out Zones

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  • 3.3 Package Loading Specifications

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  • 3.4 Package Handling Guidelines

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  • 3.5 Package Insertion Specifications

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  • 3.6 Processor Mass Specification

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  • 3.7 Processor Materials

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  • 3.8 Processor Markings

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  • 3.9 Processor Land Coordinates

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• 4 Land Listing

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• 5 Signal Definitions

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  • 5.1 Signal Definitions

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• 6 Thermal Specifications

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  • 6.1 Package Thermal Specifications

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    • 6.1.1 Thermal Specifications

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    • 6.1.2 Thermal Metrology

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  • 6.2 Processor Thermal Features

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    • 6.2.1 Processor Temperature

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    • 6.2.2 Adaptive Thermal Monitor

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    • 6.2.3 THERMTRIP# Signal

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  • 6.3 Platform Environment Control Interface (PECI)

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    • 6.3.1 Introduction

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    • 6.3.2 PECI Specifications

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  • 6.4 Storage Conditions Specifications

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• 7 Features

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  • 7.1 Power-On Configuration (POC)

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  • 7.2 Clock Control and Low Power States

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    • 7.2.1 Thread and Core Power State Descriptions

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    • 7.2.2 Package Power State Descriptions

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  • 7.3 Sleep States

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  • 7.4 ACPI P-States (Intel® Turbo Boost Technology)

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  • 7.5 Enhanced Intel SpeedStep® Technology

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• 8 Boxed Processor Specifications

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  • 8.1 Introduction

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  • 8.2 Mechanical Specifications

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    • 8.2.1 Boxed Processor Cooling Solution Dimensions

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    • 8.2.2 Boxed Processor Fan Heatsink Weight

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    • 8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

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  • 8.3 Electrical Requirements

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    • 8.3.1 Fan Heatsink Power Supply

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  • 8.4 Thermal Specifications

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    • 8.4.1 Boxed Processor Cooling Requirements

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    • 8.4.2 Variable Speed Fan

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