Intel E8200 사용자 매뉴얼

차례

• 1 Introduction

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  • 1.1 Document Goals and Scope

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    • 1.1.1 Importance of Thermal Management

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    • 1.1.2 Document Goals

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    • 1.1.3 Document Scope

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  • 1.2 References

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  • 1.3 Definition of Terms

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• 2 Processor Thermal/Mechanical Information

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  • 2.1 Mechanical Requirements

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    • 2.1.1 Processor Package

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    • 2.1.2 Heatsink Attach

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      • 2.1.2.1 General Guidelines

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      • 2.1.2.2 Heatsink Clip Load Requirement

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      • 2.1.2.3 Additional Guidelines

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  • 2.2 Thermal Requirements

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    • 2.2.1 Processor Case Temperature

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    • 2.2.2 Thermal Profile

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    • 2.2.3 Thermal Solution Design Requirements

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    • 2.2.4 TCONTROL

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  • 2.3 Heatsink Design Considerations

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    • 2.3.1 Heatsink Size

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    • 2.3.2 Heatsink Mass

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    • 2.3.3 Package IHS Flatness

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    • 2.3.4 Thermal Interface Material

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  • 2.4 System Thermal Solution Considerations

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    • 2.4.1 Chassis Thermal Design Capabilities

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    • 2.4.2 Improving Chassis Thermal Performance

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    • 2.4.3 Summary

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  • 2.5 System Integration Considerations

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• 3 Thermal Metrology

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  • 3.1 Characterizing Cooling Performance Requirements

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    • 3.1.1 Example

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  • 3.2 Processor Thermal Solution Performance Assessment

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  • 3.3 Local Ambient Temperature Measurement Guidelines

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  • 3.4 Processor Case Temperature Measurement Guidelines

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• 4 Thermal Management Logic and Thermal Monitor Feature

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  • 4.1 Processor Power Dissipation

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  • 4.2 Thermal Monitor Implementation

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    • 4.2.1 PROCHOT# Signal

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    • 4.2.2 Thermal Control Circuit

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      • 4.2.2.1 Thermal Monitor

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    • 4.2.3 Thermal Monitor 2

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    • 4.2.4 Operation and Configuration

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    • 4.2.5 On-Demand Mode

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    • 4.2.6 System Considerations

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    • 4.2.7 Operating System and Application Software Considerations

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    • 4.2.8 THERMTRIP# Signal

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    • 4.2.9 Cooling System Failure Warning

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    • 4.2.10 Digital Thermal Sensor

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    • 4.2.11 Platform Environmental Control Interface (PECI)

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• 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

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  • 5.1 Overview of the BTX Reference Design

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    • 5.1.1 Target Heatsink Performance

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    • 5.1.2 Acoustics

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    • 5.1.3 Effective Fan Curve

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    • 5.1.4 Voltage Regulator Thermal Management

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    • 5.1.5 Altitude

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    • 5.1.6 Reference Heatsink Thermal Validation

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  • 5.2 Environmental Reliability Testing

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    • 5.2.1 Structural Reliability Testing

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      • 5.2.1.1 Random Vibration Test Procedure

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      • 5.2.1.2 Shock Test Procedure

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    • 5.2.2 Power Cycling

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    • 5.2.3 Recommended BIOS/CPU/Memory Test Procedures

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  • 5.3 Material and Recycling Requirements

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  • 5.4 Safety Requirements

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  • 5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly

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  • 5.6 Preload and TMA Stiffness

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    • 5.6.1 Structural Design Strategy

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    • 5.6.2 TMA Preload verse Stiffness

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• 6 ATX Thermal/Mechanical Design Information

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  • 6.1 ATX Reference Design Requirements

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  • 6.2 Validation Results for Reference Design

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    • 6.2.1 Heatsink Performance

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    • 6.2.2 Acoustics

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    • 6.2.3 Altitude

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    • 6.2.4 Heatsink Thermal Validation

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  • 6.3 Environmental Reliability Testing

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    • 6.3.1 Structural Reliability Testing

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      • 6.3.1.1 Random Vibration Test Procedure

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      • 6.3.1.2 Shock Test Procedure

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    • 6.3.2 Power Cycling

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    • 6.3.3 Recommended BIOS/CPU/Memory Test Procedures

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  • 6.4 Material and Recycling Requirements

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  • 6.5 Safety Requirements

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  • 6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design

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  • 6.7 Reference Attach Mechanism

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    • 6.7.1 Structural Design Strategy

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    • 6.7.2 Mechanical Interface to the Reference Attach Mechanism

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• 7 Intel® Quiet System Technology (Intel® QST)

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  • 7.1 Intel® QST Algorithm

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    • 7.1.1 Output Weighting Matrix

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    • 7.1.2 Proportional-Integral-Derivative (PID)

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  • 7.2 Board and System Implementation of Intel® QST

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  • 7.3 Intel® QST Configuration & Tuning

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  • 7.4 Fan Hub Thermistor and Intel® QST

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