Intel i7-950 사용자 매뉴얼

차례

• Contents

  3
• Figures

  4
• Tables

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• Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features

  7
• Revision History

  8
• Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series

  1
• 1 Introduction

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  • 1.1 Terminology

    10
  • 1.2 References

    11
• 2 Electrical Specifications

  13
  • 2.1 Intel® QPI Differential Signaling

    13
  • 2.2 Power and Ground Lands

    13
  • 2.3 Decoupling Guidelines

    13
    • 2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling

      14
  • 2.4 Processor Clocking (BCLK_DP, BCLK_DN)

    14
    • 2.4.1 PLL Power Supply

      14
  • 2.5 Voltage Identification (VID)

    14
  • 2.6 Reserved or Unused Signals

    17
  • 2.7 Signal Groups

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  • 2.8 Test Access Port (TAP) Connection

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  • 2.9 Platform Environmental Control Interface (PECI) DC Specifications

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    • 2.9.1 DC Characteristics

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    • 2.9.2 Input Device Hysteresis

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  • 2.10 Absolute Maximum and Minimum Ratings

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  • 2.11 Processor DC Specifications

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    • 2.11.1 DC Voltage and Current Specification

      23
    • 2.11.2 VCC Overshoot Specification

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    • 2.11.3 Die Voltage Validation

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• 3 Package Mechanical Specifications

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  • 3.1 Package Mechanical Drawing

    31
  • 3.2 Processor Component Keep-Out Zones

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  • 3.3 Package Loading Specifications

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  • 3.4 Package Handling Guidelines

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  • 3.5 Package Insertion Specifications

    34
  • 3.6 Processor Mass Specification

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  • 3.7 Processor Materials

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  • 3.8 Processor Markings

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  • 3.9 Processor Land Coordinates

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• 4 Land Listing

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• 5 Signal Descriptions

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• 6 Thermal Specifications

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  • 6.1 Package Thermal Specifications

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    • 6.1.1 Thermal Specifications

      71
    • 6.1.2 Thermal Metrology

      75
  • 6.2 Processor Thermal Features

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    • 6.2.1 Processor Temperature

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    • 6.2.2 Adaptive Thermal Monitor

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    • 6.2.3 THERMTRIP# Signal

      79
  • 6.3 Platform Environment Control Interface (PECI)

    79
    • 6.3.1 Introduction

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    • 6.3.2 PECI Specifications

      81
  • 6.4 Storage Conditions Specifications

    82
• 7 Features

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  • 7.1 Power-On Configuration (POC)

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  • 7.2 Clock Control and Low Power States

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    • 7.2.1 Thread and Core Power State Descriptions

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    • 7.2.2 Package Power State Descriptions

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  • 7.3 Sleep States

    86
  • 7.4 ACPI P-States (Intel® Turbo Boost Technology)

    86
  • 7.5 Enhanced Intel® SpeedStep® Technology

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• 8 Boxed Processor Specifications

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  • 8.1 Introduction

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  • 8.2 Mechanical Specifications

    90
    • 8.2.1 Boxed Processor Cooling Solution Dimensions

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    • 8.2.2 Boxed Processor Fan Heatsink Weight

      92
    • 8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      92
  • 8.3 Electrical Requirements

    92
    • 8.3.1 Fan Heatsink Power Supply

      92
  • 8.4 Thermal Specifications

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    • 8.4.1 Boxed Processor Cooling Requirements

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    • 8.4.2 Variable Speed Fan

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