Intel Xeon 3.20GHz Processor 사용자 매뉴얼

차례

• 1 Introduction

  7
  • 1.1 Objective

    7
  • 1.2 Purpose

    7
  • 1.3 Scope

    7
• 2 Assembled Component and Package Description

  9
• 3 Mechanical Requirements

  11
  • 3.1 Attachment

    11
  • 3.2 Materials

    11
  • 3.3 Cutouts for Package Removal

    11
  • 3.4 Socket Standoffs Height

    11
  • 3.5 Markings

    12
  • 3.6 Socket Size

    12
  • 3.7 Socket/Package Translation During Actuation

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  • 3.8 Orientation in Packaging, Shipping and Handling

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  • 3.9 Contact Characteristics

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  • 3.10 Material and Recycling Requirements

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  • 3.11 Lever Actuation Requirements

    14
  • 3.12 Socket Engagement/Disengagement Force

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  • 3.13 Visual Aids

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  • 3.14 Socket BGA Co-Planarity

    14
  • 3.15 Solder Ball True Position

    14
  • 3.16 Critical-to-Function Dimensions

    14
• 4 Electrical Requirements

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  • 4.1 Electrical Resistance

    18
  • 4.2 Determination of Maximum Electrical Resistance

    22
  • 4.3 Inductance

    23
  • 4.4 Pin-to-Pin Capacitance

    25
  • 4.5 Dielectric Withstand Voltage

    25
  • 4.6 Insulation Resistance

    25
  • 4.7 Contact Current Rating

    25
• 5 Environmental Requirements

  27
  • 5.1 Mixed Flowing Gas

    28
  • 5.2 Solvent Resistance

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  • 5.3 Durability

    28
• 6 Validation Testing Requirements

  29
  • 6.1 Applicable Documents

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  • 6.2 Testing Facility

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  • 6.3 Funding

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  • 6.4 Socket Design Verification

    29
  • 6.5 Reporting

    29
  • 6.6 Process Changes

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  • 6.7 Quality Assurance Requirements

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  • 6.8 Socket Test Plan

    30
  • 6.9 Mechanical Samples

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  • 6.10 Socket Validation Notification

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  • 6.11 Production Lot Definition

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  • 6.12 Socket Validation

    30
• 7 Safety Requirements

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• 8 Documentation Requirements

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• 9 Mechanical Drawings

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