Intel Xeon E5405 사용자 매뉴얼

차례

• 1 Introduction

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  • 1.1 Objective

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  • 1.2 Scope

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  • 1.3 References

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  • 1.4 Definition of Terms

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• 2 Thermal/Mechanical Reference Design

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  • 2.1 Mechanical Requirements

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    • 2.1.1 Processor Mechanical Parameters

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    • 2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package

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    • 2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations

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  • 2.2 Processor Thermal Parameters and Features

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    • 2.2.1 Thermal Control Circuit and TDP

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    • 2.2.2 Digital Thermal Sensor

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    • 2.2.3 Platform Environmental Control Interface (PECI)

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    • 2.2.4 Multiple Core Special Considerations

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    • 2.2.5 Thermal Profile

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    • 2.2.6 TCONTROL Definition

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    • 2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series

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    • 2.2.8 Performance Targets

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  • 2.3 Fan Fail Guidelines

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  • 2.4 Characterizing Cooling Solution Performance Requirements

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    • 2.4.1 Fan Speed Control

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    • 2.4.2 Processor Thermal Characterization Parameter Relationships

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    • 2.4.3 Chassis Thermal Design Considerations

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  • 2.5 Thermal/Mechanical Reference Design Considerations

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    • 2.5.1 Heatsink Solutions

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    • 2.5.2 Thermal Interface Material

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    • 2.5.3 Summary

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    • 2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design

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    • 2.5.5 Thermal Solution Performance Characteristics

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    • 2.5.6 Thermal Profile Adherence

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    • 2.5.7 Components Overview

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    • 2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile

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• A 1U Alternative Heatsink Thermal/Mechanical Design

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  • A.1 Component Overview

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  • A.2 Thermal Solution Performance Characterics

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  • A.3 Thermal Profile Adherence

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• B Mechanical Drawings

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• C Heatsink Clip Load Methodology

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  • C.1 Overview

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  • C.2 Test Preparation

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    • C.2.1 Heatsink Preparation

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    • C.2.2 Typical Test Equipment

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    • C.2.3 Test Procedure Examples

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    • C.2.4 Time-Zero, Room Temperature Preload Measurement

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    • C.2.5 Preload Degradation under Bake Conditions

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• D Safety Requirements

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• E Quality and Reliability Requirements

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  • E.1 Intel Verification Criteria for the Reference Designs

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    • E.1.1 Reference Heatsink Thermal Verification

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    • E.1.2 Environmental Reliability Testing

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    • E.1.3 Material and Recycling Requirements

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• F Enabled Suppliers Information

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  • F.1 Supplier Information

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    • F.1.1 Intel Enabled Suppliers

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    • F.1.2 Additional Suppliers

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