Microchip Technology SC70EV 사용자 매뉴얼

차례

• Preface

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• Chapter 1. Product Overview

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  • 1.1 Introduction

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  • 1.2 What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board?

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  • 1.3 What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Kit Includes

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• Chapter 2. Installation and Operation

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  • 2.1 Introduction

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  • 2.2 Features

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  • 2.3 Getting Started

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    • 2.3.1 The Hardware

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  • 2.4 SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Description

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    • 2.4.1 Power and Ground

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    • 2.4.2 PCB PADs

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    • 2.4.3 Passive Components (RXU, RXD, C1, and C2)

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    • 2.4.4 Device Footprints

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    • 2.4.5 PICkit Serial or In-Circuit Serial Programming (ICSP) Interface (Header J1)

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    • 2.4.6 Evaluating the MCP4018 Device (A Digital Potentiometer with I2C interface)

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    • 2.4.7 Evaluating the MCP41X2 Device (A Digital Potentiometer with SPI interface)

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    • 2.4.8 The PCB as a SC70, SOT-23 to DIP Socket Converter

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• Appendix A. Schematic and Layouts

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  • A.1 Introduction

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  • A.2 Schematics and PCB Layout

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    • A.2.1 Board - Schematic

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    • A.2.2 Board - Top Trace, Silk and Pads

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    • A.2.3 Board - Bottom Trace & Pads

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    • A.2.4 Board - Layer 2 Ground Plane

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    • A.2.5 Board - Layer 3 Power Plane

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    • A.2.6 Board - Bottom Silk, Trace and Pads

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• Appendix B. Bill of Materials (BOM)

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• Appendix C. Board Revision 1 Errata

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  • C.1 Issue

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  • C.2 Solution

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  • C.3 How to Determine pCB Revision

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  • C.4 Schematics and PCB Layout of Revision 1

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    • C.4.1 Board - Schematic - Revision 1

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    • C.4.2 Board - Revision 1 - Layout Components and Silk

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    • C.4.3 Board - Revision 1 - Top Layer and Silk

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    • C.4.4 Board - Revision 1 - Bottom Layer

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    • C.4.5 Board - Revision 1 - Power Plane

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    • C.4.6 Board - Revision 1 - Ground Plane

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    • C.4.7 Board - Revision 1 - Bottom

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• Worldwide Sales and Service

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