Intel Xeon 5080 HH80555KH1094M Ficha De Dados

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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

) is indicative of a constrained thermal environment 

(that is, 1U form factor). Because of the reduced cooling capability represented by this 
thermal solution, the probability of TCC activation and performance loss is increased. 
Additionally, utilization of a thermal solution that does not meet Thermal Profile B will 
violate the thermal specifications and may result in permanent damage to the 
processor. Intel has developed these thermal profiles to allow OEMs to choose the 
thermal solution and environmental parameters that best suit their platform 
implementation. Refer to the Dual-Core Intel

Mechanical Design Guidelines for details on system thermal solution design, thermal 
profiles and environmental considerations.

The Dual-Core Intel Xeon Processor 5063 (MV) supports a single Thermal Profile 
targeted at volumetrically constrained thermal environments (for example, blades, 1U 
form factors.) With this Thermal Profile, it’s expected that the Thermal Control Circuit 
(TCC) would only be activated for very brief periods of time when running the most 
power-intensive applications. Refer to the Dual-Core Intel

Series Thermal/Mechanical Design Guidelines for further details. 

The upper point of the thermal profile consists of the Thermal Design Power (TDP) 
defined in 

 and the associated T

CASE

 value. It should be 

noted that the upper point associated with Thermal Profile B (x = TDP and y = 
T

CASE_MAX_B

 @ TDP) represents a thermal solution design point. In actuality the 

processor case temperature will not reach this value due to TCC activation (refer to 

). The lower point of the thermal profile consists of x = 

P_profile_min and y = T

CASE_MAX

 @ P_profile_min. P_profile_min is defined as the 

processor power at which T

CASE

 , calculated from the thermal profile, is equal to 50

 °

C. 

The case temperature is defined at the geometric top center of the processor IHS. 
Analysis indicates that real applications are unlikely to cause the processor to consume 
maximum power dissipation for sustained time periods. Intel recommends that 
complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

, instead of the maximum processor power 

consumption. The Thermal Monitor feature is intended to help protect the processor in 
the event that an application exceeds the TDP recommendation for a sustained time 
period. For more details on this feature, refer to 

. To ensure maximum 

flexibility for future requirements, systems should be designed to the Flexible 
Motherboard (FMB) guidelines, even if a processor with lower power dissipation is 
currently planned. The Thermal Monitor feature must be enabled for the 
processor to remain within its specifications.

1.

These values are specified at V

CC_MAX

 for all processor frequencies. Systems must be designed to ensure 

the processor is not to be subjected to any static V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_MAX

 at 

specified I

CC

. Please refer to the loadline specifications in 

2.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

3.

These specifications are based on final silicon validation/characterization. 

4.

Power specifications are defined at all VIDs found in 

. The Dual-Core Intel Xeon Processor 5000 

series may be shipped under multiple VIDs for each frequency.

5.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 

frequency requirements. 

Launch to FMB

130

5

Refer to 

1, 2, 3, 4, 5