Intel 200 Manual Do Utilizador

28  

 

Thermal and Mechanical Design Guidelines 

For reference thermal solution of Intel Celeron processor 200 sequence on Intel 

Desktop Board D201GLY2, the junction-to-local ambient thermal characterization 

parameter of the processor, Ψ

JA

, is comprised of Ψ

JS

, the thermal interface material 

thermal characterization parameter, Ψ

HS_BASE

 the thermal characterization parameter 

of the heatsink base from bottom center of heatsink base to top center of heatsink 

base surface, and of Ψ

S-TOP-A

, the sink-to-local ambient thermal characterization 

parameter: 

Equation 3    

Ψ

JA 

= 

Ψ

JS

 + 

Ψ

HS_BASE

 + 

Ψ

S-TOP-A

 

Where: 

Ψ

JS

 

=  Thermal characterization parameter of the thermal interface material 

(°C/W) 

Ψ

 HS_BASE

 =  Thermal characterization parameter of the heatsink base (°C/W) 

Ψ

S-TOP-A

  =  Thermal characterization parameter from heatsink top to local 

ambient (°C/W) 

Ψ

JS

 is strongly dependent on the thermal conductivity, thickness and performance 

degradation across time of the TIM between the heatsink and processor die.   

Ψ

 HS_BASE

 is a measure of the thermal characterization parameter of the heatsink base.  

It is dependent on the heatsink base material, thermal conductivity, thickness and 

geometry.   

Ψ

S-TOP-A

 is a measure of the thermal characterization parameter from the top center 

point of the heatsink base to the local ambient air.  Ψ

S-TOP-A

 is dependent on the 

heatsink material, thermal conductivity, and geometry.  It is also strongly dependent 

on the air flow through the fins of the heatsink. 

Equation 4    (

Ψ

JA 

− Ψ

JS 

− Ψ

HS_BASE

) 

× P

D 

+ T

A

 = T

S-TOP-MAX 

With a given processor junction-to-local ambient requirement (Ψ

JA

) and TIM 

performance (Ψ

JS

) and processor power consumption (P

D

), the processor’s heatsink 

requirement (T

S-TOP-MAX

)

 

could be defined by Equation 4.