Intel BX80635E52697V2 Manual Do Utilizador

 

110

Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families 

Datasheet Volume One of Two

1.

Figure is not to scale and is for reference only.

2.

This is an example for package size 52.5 x 45 mm.

3.

B1: Max = 52.57 mm, Min = 52.43 mm.

4.

B2: Max = 45.07 mm, Min = 44.93 mm.

5.

C1: Max = 43.1 mm, Min = 42.9 mm.

6.

C2: Max = 42.6 mm, Min = 42.4 mm.

7.

C3: Max = 2.35 mm, Min = 2.15 mm.

A new feature in the processor is a software readable field in the 
TEMPERATURE_TARGET MSR register that contains the minimum temperature at which 

the TCC will be activated and PROCHOT_N will be asserted. The TCC activation 

temperature is calibrated on a part-by-part basis and normal factory variation may 
result in the actual TCC activation temperature being higher than the value listed in the 

register. TCC activation temperatures may change based on processor stepping, 

frequency or manufacturing efficiencies.

The Adaptive Thermal Monitor feature provides an enhanced method for controlling the 

processor temperature when the processor silicon reaches its maximum operating 

temperature. Adaptive Thermal Monitor uses Thermal Control Circuit (TCC) activation 
to reduce processor power via a combination of methods. The first method 

(Frequency/SVID control) involves the processor adjusting its operating frequency (via 

the core ratio multiplier) and input voltage (via the SVID signals). This combination of