Intel BX80635E52697V2 Manual Do Utilizador
Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families,
209
Datasheet Volume One of Two
Package Mechanical Specifications
9
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA12) package that
interfaces with the baseboard via an LGA2011-0 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
shows a sketch
of the processor package components and how they are assembled together. Refer to
the Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families Thermal /
Mechanical Design Guide
Mechanical Design Guide
for complete details on the LGA2011-0 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1.
Socket and baseboard are included for reference and are not part of the processor package.
9.1
Package Size and SKUs
The processor is supported in two package sizes:
• Package A: 52.5 mm x 45 mm and
• Package B: 52.5 mm x 51 mm
• Package B: 52.5 mm x 51 mm
Below is a table that shows the associated processor SKUs with the package sizes. For
details on processor SKU information, see
Figure 9-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
TIM
LGA2011-0 Socket
Die